Active thermal interposer device with thermal isolation structures

A testing device for testing an integrated circuit device under test (DUT), said testing device comprising:

• a stand-alone active thermal interposer device for use in testing said DUT and for coupling with a thermal controller, said stand-alone active thermal interposer device comprising:
• a body layer having a first surface and a second surface, wherein said first surface is operable to be disposed adjacent to a cold plate;
• and
• a plurality of heating zones defined across a second surface of said body layer, said plurality of heating zones operable to be controlled by said thermal controller to selectively heat and maintain respective temperatures thereof, said plurality of heating zones operable to heat a plurality of areas of said DUT when said second surface of said body layer is disposed adjacent to an interface surface of said DUT during said testing of said DUT;
• and
• a plurality of thermal resistance structures formed in said body layer and operable to resist thermal conductance between the plurality of heating zones.

A testing arrangement for testing an integrated circuit device under test (DUT), said testing arrangement comprising:

• a socket device for containing said DUT and for interfacing with a load board;
• a stand-alone active thermal interposer device for use in testing said DUT, said stand-alone active thermal interposer device comprising:
• a body layer having a first surface and a second surface, wherein said first surface is operable to be disposed adjacent to a cold plate;
• and
• a plurality of heating zones defined across a second surface of said body layer, said plurality of heating zones operable to be controlled to selectively heat and maintain respective temperatures thereof, said plurality of heating zones operable to heat a plurality of areas of the DUT when said stand-alone active thermal interposer device is inserted into said socket device and said second surface of said body layer is disposed adjacent to an interface surface of said DUT;
• and
• wherein said body layer comprises a plurality of thermal resistance structures configured to resist thermal conductance between the plurality of heating zones.