US 12,625,161 B2 · Semiconductor module inspection device

Abstract

A semiconductor module inspection device of the present disclosure includes a PCB substrate, an IC socket that accommodates a semiconductor module disposed on a first main surface of the PCB substrate, a first temperature control device disposed in contact with an upper surface of the IC socket, and a second temperature control device disposed in contact with a second main surface of the PCB substrate. In an embodiment, the first temperature control device and the second temperature control device have a Peltier element and a heat dissipation fin. In an embodiment, the semiconductor module inspection device further includes a chamber structure including a chamber upper portion connected to the heat dissipation surface of the first temperature control device, a chamber lower portion connected to the heat dissipation surface of the second temperature control device, and a purge mechanism for purging the chamber internal space with dried air.

Claims13

Dependent claims

A semiconductor module inspection device, comprising:

a printed circuit board (PCB) substrate;
an integrated circuit (IC) socket that accommodates a semiconductor module disposed on a first main surface of the PCB substrate;
a first temperature control device disposed in contact with an upper surface of the IC socket;
a second temperature control device disposed in contact with a second main surface of the PCB substrate;
and
a chamber structure including a chamber upper portion in direct contact with a heat dissipation surface of the first temperature control device and a chamber lower portion in direct contact with a heat dissipation surface of the second temperature control device.

3 more elements

Dependencies are inferred from the claim text.

Semiconductor module inspection device

Life of this patent

Semiconductor module inspection device

Life of this patent

Abstract

Claims13