Inspection system with thermal interface, and electronic component inspection device and method

An electronic component inspection method, comprising the following steps:

• (A) contacting, by a temperature regulator, at least one electronic component to be tested, wherein there is a thermal interface between the temperature regulator and the at least one electronic component to be tested, and the at least one electronic component to be tested comprises a plurality of temperature sensing units;
• (B) heating or cooling, by the temperature regulator, the electronic component to be tested at a specific temperature;
• and
• (C) detecting, by the plurality of temperature sensing units of the at least one electronic component to be tested, temperatures at locations of the temperature sensing units, wherein the plurality of temperature sensing units are configured to detect leakage currents of a plurality of diodes, and calculate the temperatures at the locations of the plurality of temperature sensing units based on the leakage currents.

An electronic component inspection device, comprising:

• a test socket comprising a chip slot, wherein the chip slot is configured to accommodate at least one electronic component to be tested;
• the chip slot comprises an electrical contact interface that is configured to electrically contact the at least one electronic component to be tested;
• and the at least one electronic component to be tested comprises a plurality of temperature sensing units;
• a workpress comprising a temperature regulator, wherein the workpress selectively movable towards or away from the test socket;
• and
• a controller electrically connected to the test socket and the workpress,
• wherein, in response to the at least one electronic component to be tested being accommodated in the chip slot of the test socket, the controller controls the workpress to move towards the test socket and contact the at least one electronic component to be tested, and there is a thermal interface between the workpress and the at least one electronic component to be tested;
• the controller controls the temperature regulator to heat or cool the electronic component to be tested to a specific temperature, and temperatures at locations of the plurality of temperature sensing units are detected through the plurality of temperature sensing units, wherein the plurality of temperature sensing units are configured to detect leakage currents of a plurality of diodes, and calculate the temperatures at the locations of the plurality of temperature sensing units based on the leakage currents.