Active thermal interposer device with thermal isolation structures

A system for regulating temperature of a device under test (DUT) during testing thereof, said system comprising:

• an active thermal interposer (ATI) device comprising:
• a body layer having a first surface and a second surface, wherein said second surface is operable to be disposed in proximity to said DUT;
• and
• wherein said body layer further comprises a heating layer defining a plurality of heating zones across said second surface, said plurality of heating zones operable to be controlled during said testing to selectively heat and maintain respective temperatures thereof, said heating layer further comprising:
• a plurality of heating structures operable to selectively heat and maintain temperatures of said plurality of heating zones;
• and
• a plurality of thermal resistance structures operable to resist thermal conductance between the plurality of heating zones;
• a cold plate operable to be disposed adjacent to said first surface;
• and
• a thermal controller operable to control temperatures of said plurality of heating zones during said testing by controlling selective heating of said heating zones and by controlling cooling of said cold plate.

A method of regulating temperature of a device under test (DUT), said method comprising:

• testing said DUT;
• and
• during said testing, regulating and maintaining temperatures of said DUT using an active thermal interposer (ATI) device in combination with a cold plate, wherein said ATI device comprises:
• a body layer having a first surface and a second surface, wherein said first surface is operable to be disposed adjacent to said cold plate and wherein said second surface is operable to be disposed in proximity to said DUT;
• and
• wherein said body layer further comprises a heating layer defining a plurality of heating zones across said second surface, said plurality of heating zones operable to be controlled during said testing to selectively heat and maintain respective temperatures thereof, said heating layer further comprising:
• a plurality of heating structures operable to selectively heat and maintain temperatures of said plurality of heating zones;
• and
• a plurality of thermal resistance structures operable to resist thermal conductance between the plurality of heating zones.