Non-destructive burn-in test socket for integrated circuit die
AssigneeTexas Instruments Incorporated
InventorsRichard A. Elder, Randy Johnson, Dean L. Frew, Arthur M. Wilson
Life of this patent
Estimating the term…
Abstract
Disclosed is a burn-in test socket which serves as a temporary package for integrated circuit die, multichip hybrid or a complete wafer without damaging the bonding pads or insulating passivation on the die during test and burn-in.
Claims25
A non-destructive burn-in test socket for interconnecting with contact pads on an integrated circuit die, comprising:
- a test socket base for plugging into a test system;
- a flexible membrane assembly connected to the test socket base and having a plurality of contacts thereon for temporarily contacting the contact pads on a semiconductor die during testing;
- bond pads on said test socket base for interconnecting with the flexible membrane assembly;
- and
- a heat sink for holding a semiconductor die in temporary contact with the contacts on the flexible membrane assembly and transferring heat from the semiconductor die during testing;
- wherein the test socket base includes an opening to permit visual alignment of the semiconductor die with the contacts on the flexible membrane.
A non-destructive burn-in test socket for connecting to contact pads on an integrated circuit die, comprising:
- a test socket base for plugging into a test system;
- a flexible membrane assembly connected to the test socket base and having a plurality of contacts extending through the membrane for interconnecting the semiconductor die to the test socket base;
- wherein the flexible membrane assembly includes a flexible membrane attached to a metal frame, and includes metal leads extending from the plurality of contacts for temporarily contacting the contact pads on the semiconductor die to a plurality of wire bond pads;
- bond pads on said test socket base for interconnecting with the flexible membrane assembly;
- and
- a heat sink for holding a semiconductor die in temporary contact with the contacts on the flexible membrane assembly and transferring heat from the semiconductor die during testing;
- wherein the test socket base includes an opening to permit visual alignment of the semiconductor die with the contacts on the flexible membrane.
A non-destructive burn-in test socket for temporarily connecting to contact pads on an integrated circuit die, comprising:
- a test socket base for plugging into a test system;
- a flexible membrane assembly for interfacing with the test socket base, and having a plurality of contacts extending through the membrane for temporarily interconnecting the semiconductor die to the test socket base;
- bond pads on said test socket base for interconnecting with the flexible membrane assembly;
- and
- a heat sink for holding the semiconductor die in temporary contact with the contacts on the flexible membrane assembly and transferring heat from the semiconductor die during testing.
Dependencies are inferred from the claim text.