G01R 1/0483
Sockets for unleaded ic's having matrix type contact fields
Official title: {Sockets for unleaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips}
G01R1/0483 (Sockets for unleaded ic's having matrix type contact fields) appears on 869 US grants and 680 published applications in this corpus.
Search patents in G01R- Granted patents
- 869
- Published applications
- 680
- Assignees
- 271
- Inventors
- 1,117
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 2 | 0 |
| 1990 | 2 | 0 |
| 1991 | 5 | 0 |
| 1992 | 5 | 0 |
| 1993 | 4 | 0 |
| 1994 | 11 | 0 |
| 1995 | 12 | 0 |
| 1996 | 27 | 0 |
| 1997 | 18 | 0 |
| 1998 | 24 | 0 |
| 1999 | 28 | 0 |
| 2000 | 36 | 0 |
| 2001 | 60 | 33 |
| 2002 | 76 | 48 |
| 2003 | 53 | 57 |
| 2004 | 46 | 50 |
| 2005 | 54 | 51 |
| 2006 | 52 | 54 |
| 2007 | 39 | 41 |
| 2008 | 25 | 28 |
| 2009 | 30 | 26 |
| 2010 | 23 | 23 |
| 2011 | 19 | 19 |
| 2012 | 13 | 22 |
| 2013 | 12 | 15 |
| 2014 | 14 | 16 |
| 2015 | 16 | 21 |
| 2016 | 11 | 13 |
| 2017 | 14 | 15 |
| 2018 | 16 | 18 |
| 2019 | 13 | 15 |
| 2020 | 14 | 13 |
| 2021 | 15 | 19 |
| 2022 | 20 | 14 |
| 2023 | 16 | 22 |
| 2024 | 15 | 23 |
| 2025 | 15 | 12 |
| 2026 | 7 | 12 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Socket for testing semiconductor device18 Aug 2026US 12,710,446 B2Samsung Electronics Co., Ltd.
- Testing apparatus and method of using the same11 Aug 2026US 12,704,525 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Socket and inspection socket14 Jul 2026US 12,681,041 B2Enplas Corporation
- Socket device for testing ICs26 May 2026US 12,638,473 B2Hicon Co., Ltd.
- Test socket24 Mar 2026US 12,584,944 B2Tse Co., Ltd.
- Metal molded product21 May 2026US 2026/0140142 A1Point Engineering Co., Ltd.
- Test socket30 Apr 2026US 2026/0118379 A1Hicon Co., Ltd.
- Test system for semiconductor package structures with stepped socket housing plate and methods of using the same30 Apr 2026US 2026/0123364 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Test Socket for Enhancing Integrated Circuit Chip Testing and a Manufacturing Method Thereof23 Apr 2026US 2026/0110709 A1He Chou Technology INC.
- Test system with improved contact blade design and methods of using the same26 Mar 2026US 2026/0086112 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Flexible contact structure with an electrically conductive shell340US 5,917,707 AFormFactor, Inc. · 1999
- Non-destructive burn-in test socket for integrated circuit die244US 5,123,850 ATexas Instruments Incorporated · 1992
- Method for forming an interconnect having a penetration limited contact structure for establishing a temporary electrical connection with a semiconductor die241US 5,686,317 AMicron Technology, Inc. · 1997
- Method of making a metallized recess in a substrate241US 6,169,021 AMicron Technology, Inc. · 2001