Test system for semiconductor package structures with stepped socket housing plate and methods of using the same

Abstract

Test systems and methods testing semiconductor package structures including an improved socket housing plate design that provides improved testing reliability and accuracy. The upper surface of the socket housing plate includes a non-planar shape, such as a stepped configuration including a plurality of different regions having different vertical elevations. The non-planar shape of the upper surface of the socket housing plate may mimic the warpage characteristics of the semiconductor package structures being tested, which may enable improved contact between the semiconductor package structure and the contact pins of the test system. This may improve the accuracy of the testing and reduce the occurrence of “false reject” tests.

Dependencies are inferred from the claim text.