Test Socket for Enhancing Integrated Circuit Chip Testing and a Manufacturing Method Thereof

Abstract

A test socket for testing integrated circuit (IC) chips and a manufacturing method for the test socket are disclosed. The test socket comprises an insulating support structure having a plurality of through holes and a plurality of elastic conductive posts. The conductive posts are partially embedded in the support structure and extend through the through holes to accommodate variations due to IC package warpage and ball grid array (BGA) solder ball size tolerances. The insulating support structure further includes grooves adjacent to the through holes to securely fasten the conductive posts. Each conductive post features an elastic structure with at least a portion of its circumferential surface covered by an insulating material layer to prevent short circuits. The test socket further comprises a rigid support frame—potentially made of polyimide, PCB material, or ceramic—and a soft support frame made of silicone, which is both durable and flexible.

Dependencies are inferred from the claim text.