Test system with improved contact blade design and methods of using the same

Abstract

Test systems and methods testing semiconductor package structures including an improved contact blade design that provides improved testing reliability and minimizes damage to the package structure. The contact blade includes a “die pusher” having a lower surface that contacts an upper surface of the package structure in a region including one or more dies and an encapsulant material. The lower surface of the die pusher includes a non-planar contoured shape, such as a convex or concave shape, that is complementary to the non-planar shape of the upper surface of the package substrate. The lower surface of the die pusher includes a trench that corresponds to the location of a gap between adjacent dies of the package structure when the die pusher contacts the upper surface of the package structure. The contact blade may apply pressure more evenly to the package structure to improve test reliability while minimizing damage.

Dependencies are inferred from the claim text.