Socket device for testing ICs

A socket device for testing integrated circuits (ICs), the socket device comprising:

• a ground probe and a signal probe, each including:
• an upper contact pin,
• a lower contact pin, and
• a coil spring,
• wherein each of the upper contact pin and the lower contact pin has a pair of elastic parts symmetrically protruding in the longitudinal direction from an end thereof, and the upper contact pin and the lower contact pin are assembled in a crossed manner through the pairs of elastic parts such that the upper contact pin and the lower contact pin are configured to move longitudinally relative to each other, and
• wherein the coil spring is configured to elastically support the upper contact pin and the lower contact pin, and a crossing portion between the upper contact pin and the lower contact pin is disposed in an interior of the coil spring;
• a socket body with electrical insulation properties formed with a ground hole where the ground probe is accommodated and a signal hole where the signal probe is accommodated, and provided with a support portion for supporting upper ends of the ground probe and the signal probe;
• a plating layer formed on a surface of the ground hole to make electrical contact with the ground hole;
• and
• an electrically-insulating lower insulating thin film member provided with a through hole where a lower tip portion of the ground probe or the signal probe protrudes to support lower ends of the probes, and attached to a lower part of the socket body.

A socket device for testing integrated circuits (ICs), the socket device comprising:

• a ground probe and a signal probe, each including:
• an upper contact pin,
• a lower contact pin, and
• a coil spring,
• wherein each of the upper contact pin and the lower contact pin has a pair of elastic parts symmetrically protruding in the longitudinal direction from an end thereof, and the upper contact pin and the lower contact pin are assembled in a crossed manner through the pairs of elastic parts such that the upper contact pin and the lower contact pin are configured to move longitudinally relative to each other, and
• wherein the coil spring is configured to elastically support the upper contact pin and the lower contact pin, and a crossing portion between the upper contact pin and the lower contact pin is disposed in an interior of the coil spring;
• a conductive socket body formed with a ground hole where the ground probe is accommodated and a signal hole where the signal probe is accommodated;
• an insulating layer formed on a surface of the signal hole to electrically insulate the signal probe and the socket body;
• an electrically-insulating upper insulating thin film member provided with a first through hole where an upper tip portion of the ground probe or the signal probe protrudes to support upper ends of the probes, and attached to an upper part of the socket body;
• and
• an electrically-insulating lower insulating thin film member provided with a second through hole where a lower tip portion of the ground probe or the signal probe protrudes to support lower ends of the probes, and attached to a lower part of the socket body.

A socket device for testing integrated circuits (ICs), the socket device comprising:

• a ground probe and a signal probe, each including:
• an upper contact pin,
• a lower contact pin, and
• a coil spring,
• wherein each of the upper contact pin and the lower contact pin has a pair of elastic parts symmetrically protruding in the longitudinal direction from an end thereof, and the upper contact pin and the lower contact pin are assembled in a crossed manner through the pairs of elastic parts such that the upper contact pin and the lower contact pin are configured to move longitudinally relative to each other, and
• wherein the coil spring is configured to elastically supporting the upper contact pin and the lower contact pin, and a crossing portion between the upper contact pin and the lower contact pin is disposed in an interior of the coil spring;
• a socket body with electrical insulation properties formed with a ground hole where the ground probe is accommodated and a signal hole where the signal probe is accommodated;
• a plating layer formed on a surface of the ground hole to make electrical contact with the ground hole;
• an electrically-insulating upper insulating thin film member provided with a first through hole where an upper tip portion of the ground probe or the signal probe protrudes to support upper ends of the probes, and attached to an upper part of the socket body;
• and
• an electrically-insulating lower insulating thin film member provided with a second through hole where a lower tip portion of the ground probe or the signal probe protrudes to support lower ends of the probes, and attached to a lower part of the socket body.