G01R 1/0475
For tab ic's
Official title: {for TAB IC's}
G01R1/0475 (For tab ic's) appears on 14 US grants and 2 published applications in this corpus.
Search patents in G01R- Granted patents
- 14
- Published applications
- 2
- Assignees
- 8
- Inventors
- 27
- Latest grant
- 6 Apr 2021
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 2 | 0 |
| 1991 | 2 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 1 |
| 2011 | 1 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 1 |
| 2021 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Reliability test fixture for flexible display component and online reliability test device for flexible display component6 Apr 2021US 10,971,042 B2Kunshan New Flat Panel Disp. Tech. Center Co., Ltd
- Multi-socket guide and test device comprising the same4 Oct 2011US 8,029,292 B2Samsung Electronics Co., Ltd.
- Method for testing a tape carrier package3 Oct 2000US 6,127,196 AIntel Corporation
- Tab tape-based bare chip test and burn-in carrier12 Aug 1997US 5,656,941 A
- Burn-in socket used in a burn-in test for semiconductor chips4 Jun 1996US 5,523,586 AKabushiki Kaisha Toshiba
- Reliability test fixture for flexible display component and online reliability test device for flexible display component25 Jun 2020US 2020/0202757 A1Kunshan New Flat Panel Disp. Tech. Center Co., Ltd
- Multi-socket guide and test device comprising the same18 Mar 2010US 2010/0068914 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Discrete die burn-in for nonpackaged die225US 4,899,107 AMicron Technology, Inc. · 1990
- Directly bonded simm module162US 4,992,850 AMicron Technology, Inc. · 1991
- Electrical socket for TAB IC's62US 4,969,828 AAMP Incorporated · 1990
- Burn-in socket used in a burn-in test for semiconductor chips34US 5,523,586 AKabushiki Kaisha Toshiba · 1996
- Multipurpose socket33US 4,859,189 AMinnesota Mining and Manufacturing Company · 1989