Burn-in socket used in a burn-in test for semiconductor chips

A socket for burn-in testing semiconductor chips, comprising

• a chip container including
• a recess, formed of a metallic member having high heat radiation, for containing at least one semiconductor chip in a bare state, the recess including an adsorption hole through which said at least one semiconductor chip is temporarily fixed, and
• a plurality of internal terminals arranged around the recess, the plurality of internal terminals being connected to a plurality of external terminals;
• and
• a transparent cover member including a lead frame adhered thereto, the lead frame having a plurality of lead terminals for electrically connecting the plurality of internal terminals and chip electrodes of said at least one semiconductor chip contained in the recess of said chip container,
• whereby the burn-in testing is carried out for said at least one semiconductor chip while confirming through said transparent cover member that the plurality of lead terminals are connected to the chip electrodes and the plurality of internal terminals.

A socket for burn-in testing semiconductor chips, comprising:

• a chip container including
• a recess for containing at least one semiconductor chip in a bare state and
• a plurality of internal terminals arranged around the recess, the plurality of internal terminals being connected to a plurality of external terminals;
• a transparent cover member including a lead frame adhered thereto, the lead frame having a plurality of lead terminals for electrically connecting the plurality of internal terminals and chip electrodes of said at least one semiconductor chip contained in the recess of said chip container;
• and
• a clamp jig for fixing said cover member to an upper surface of said chip container with an elastic member positioned therebetween,
• whereby the burn-in testing is carried out for said at least one semiconductor chip while confirming through said transparent cover member that the plurality of lead terminals are connected to the chip electrodes and the plurality of internal terminals.

A socket for burn-in testing semiconductor chips, comprising:

• a chip container including
• a recess formed of a metallic member having high heat radiation, the recess having an absorption hole through which at least one semiconductor chip in a bare state is temporarily fixed in the recess, and
• a plurality of internal terminals arranged around the recess, the plurality of internal terminals being connected to a plurality of external terminals;
• a transparent cover member including
• a TAB (Tape Automated Bonding) type lead frame adhered to the transparent cover member, the lead frame having a plurality of lead terminals for electrically connecting the plurality of internal terminals and chip electrodes of said at least one semiconductor chip temporarily fixed in the recess of said chip container;
• and
• a clamp jig for fixing said transparent cover member to an upper surface of said chip container with an elastic member positioned therebetween, while confirming through said transparent cover member that the plurality of lead terminals are connected to the chip electrodes and the plurality of internal terminals.