Multi-socket guide and test device comprising the same
AssigneeSamsung Electronics Co., Ltd.
InventorsHong-jun Jin, Jong-mi Kim, Yoon-gyu Song
Life of this patent
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Abstract
A multi-socket guide for guiding a semiconductor package to a semiconductor package testing device includes a housing, a guiding unit disposed in the housing, the guiding unit guiding the housing to the semiconductor package testing device, and a mounting unit disposed in the housing, the mounting unit receiving the semiconductor package, wherein a size of the mounting unit corresponds to a size of a ball area of the semiconductor package.
Claims20
A multi-socket guide for guiding a semiconductor package to a semiconductor package test device, the multi-socket guide comprising:
- a housing;
- a guiding unit disposed in the housing, the guiding unit guiding the housing to the semiconductor package test device;
- and
- a mounting unit disposed in the housing, wherein a size of the mounting unit corresponds to a size of a ball area disposed on a lower surface of the semiconductor package, and the mounting unit comprises a groove configured to receive and cover an entire upper surface of the semiconductor package, wherein the upper and lower surfaces of the semiconductor package oppose each other,
- wherein the housing comprises a shock absorbing material disposed on a first surface facing the semiconductor package test device.
A semiconductor package test device, comprising:
- a multi-socket guide comprising:
- a housing;
- a guiding unit disposed in the housing, the guiding unit guiding the housing to the semiconductor package test device;
- and
- a mounting unit disposed in the housing, wherein a size of the mounting unit corresponds to a size of a ball area disposed on a lower surface of a semiconductor package, and the mounting unit comprises a groove configured to receive and cover an entire upper surface of the semiconductor package, wherein the upper and lower surfaces of the semiconductor packages oppose each other;
- and
- a test board having a contact unit thereon, the contact unit receiving the multi-socket guide,
- wherein the housing has a substantially rectangular shape, the guiding unit includes circular grooves located near four corners of the housing, and the semiconductor package test device includes circular projections configured to be coupled to the circular grooves.
Dependencies are inferred from the claim text.