Multi-socket guide and test device comprising the same
AssigneeSamsung Electronics Co., Ltd.
InventorsHong-jun Jin, Jong-rni Kim, Yoon-gyu Song
Life of this patent
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Abstract
A multi-socket guide for guiding a semiconductor package to a semiconductor package testing device includes a housing, a guiding unit disposed in the housing, the guiding unit guiding the housing to the semiconductor package testing device, and a mounting unit disposed in the housing, the mounting unit receiving the semiconductor package, wherein a size of the mounting unit corresponds to a size of a ball area of the semiconductor package.
Claims20
A multi-socket guide for guiding a semiconductor package to a semiconductor package testing device, the multi-socket guide comprising:
- a housing;
- a guiding unit disposed in the housing, the guiding unit guiding the housing to the semiconductor package testing device;
- and
- a mounting unit disposed in the housing, the mounting unit receiving the semiconductor package,
- wherein a size of the mounting unit corresponds to a size of a ball area of the semiconductor package.
The multi-socket guide of claim 2, wherein a plurality of balls are formed in the ball area.
A semiconductor package test device, comprising, a multi-socket guide including:
- a housing;
- a guiding unit disposed in the housing, the guiding unit guiding the housing to the semiconductor package testing device;
- and
- a mounting unit disposed in the housing, the mounting unit receiving the semiconductor package, wherein a size of the mounting unit corresponds to a size of a ball area of the semiconductor package;
- and
- a test board having a contact unit thereon, the contact unit receiving the multi-socket guide.
Dependencies are inferred from the claim text.