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US 6,891,385 B2Granted
Probe card cooling assembly with direct cooling of active electronic components
AssigneeFormFactor, Inc.
InventorCharles A. Miller
Life of this patent
Estimating the term…
Abstract
A probe card cooling assembly for use in a test system includes a package with one or more dies cooled by direct cooling. The cooled package includes one or more dies with active electronic components and at least one coolant port that allows a coolant to enter the high-density package and directly cool the active electronic components of the dies during a testing operation.
Claims16
A probe card assembly comprising:
- probe elements;
- and
- a package coupled to the probe elements, wherein the package includes at least one die with active electronic components and at least one coolant port that allows a coolant to enter the package and directly cool the active electronic components of each die during a test operation.
A probe card assembly comprising:
- a cooled package;
- and
- a coolant circulation system that carries circulating coolant to and from said cooled package;
- wherein the cooled package comprises at least one die coupled through compliant interconnects to the cooled package, and
- wherein the at least one die has active electronic components that emit heat during a testing operation and the heat is transferred by the circulating coolant directly contacting the at least one die to transfer heat away from the active electronic components of each die during the testing.
2 more elements
A probe card assembly comprising:
- probe elements;
- and
- a package coupled to the probe elements so that the probe elements extend external to the package, wherein the package includes at least one die with active electronic components electrically connected to the probe elements, and at least one coolant port that allows a coolant to enter the package and cool the active electronic components of each die during a test operation.
Dependencies are inferred from the claim text.