Wafer inspection method and inspection apparatus

A wafer inspection method, comprising:

• a preparation step of providing a probe module, wherein the probe module comprises a first probe, a second probe and a processing module, the first probe is coupled to the processing module, and the second probe is grounded, and the processing module comprises a driver, a comparing unit and a logic element;
• an initial route establishing step of coupling the first probe to a first electrode point of a die on a wafer, and coupling the second probe to a second electrode point of the die, so that the die is disposed in a test loop between the processing module and the ground;
• and
• an inspection step of providing a driving current through the first probe and the first electrode point to the die disposed in the test loop by the driver of the processing module, obtaining a corresponding inspection voltage of the die by the comparing unit of the processing module, and generating an inspection result of the inspection voltage based on two reference voltages by the logic element of the processing module,
• wherein, the two reference voltages respectively represent a high critical threshold value and a low critical threshold value of the die, and by separately comparing the inspection voltage with each of the two reference voltages, two corresponding comparison results are obtained, wherein the two comparison results are used to determine which category among a plurality of categories the die belongs to, thereby defining the inspection result, wherein the categories include a first category where the inspection voltage is greater than the low critical threshold and less than the high critical threshold, and a second category where the inspection voltage is greater than or equal to the high critical threshold or less than or equal to the low critical threshold, wherein the logic element is coupled to the comparing unit to store the two comparison results and define the inspection result based on whether the die belongs to the first category or the second category, wherein the die is determined as being in a normal state when belonging to the first category and in an abnormal state when belonging to the second category.