G01R 1/07371
Using an intermediate card or back card with apertures through which the
Official title: {using an intermediate card or back card with apertures through which the probes pass}
G01R1/07371 (Using an intermediate card or back card with apertures through which the) appears on 360 US grants and 355 published applications in this corpus.
Search patents in G01R- Granted patents
- 360
- Published applications
- 355
- Assignees
- 141
- Inventors
- 584
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 2 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 3 | 0 |
| 1988 | 6 | 0 |
| 1989 | 6 | 0 |
| 1990 | 5 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 3 | 0 |
| 1997 | 3 | 0 |
| 1998 | 5 | 0 |
| 1999 | 10 | 0 |
| 2000 | 4 | 0 |
| 2001 | 5 | 2 |
| 2002 | 10 | 8 |
| 2003 | 9 | 8 |
| 2004 | 11 | 13 |
| 2005 | 9 | 13 |
| 2006 | 9 | 12 |
| 2007 | 7 | 15 |
| 2008 | 12 | 20 |
| 2009 | 11 | 11 |
| 2010 | 14 | 9 |
| 2011 | 3 | 10 |
| 2012 | 12 | 11 |
| 2013 | 6 | 6 |
| 2014 | 11 | 6 |
| 2015 | 8 | 21 |
| 2016 | 9 | 8 |
| 2017 | 15 | 21 |
| 2018 | 15 | 10 |
| 2019 | 17 | 31 |
| 2020 | 21 | 19 |
| 2021 | 24 | 21 |
| 2022 | 16 | 14 |
| 2023 | 11 | 16 |
| 2024 | 16 | 17 |
| 2025 | 13 | 17 |
| 2026 | 10 | 16 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Ceramic, probe guiding member, probe card and socket for package inspection6 Oct 2026US 12,753,124 B2Ferrotec Material Technologies Corporation
- Probe assembly with downward-protruding probe shield and methods of operating the same29 Sep 2026US 12,748,131 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Probe head for loopback testing and methods of forming the same22 Sep 2026US 12,742,795 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Probe card device having expansion configuration and probe head thereof8 Sep 2026US 12,730,129 B2Chunghwa Precision Test Tech. Co., Ltd.
- Probe head for wafer-level burn-in test (WLBI) and probe card comprising said probe head9 Jun 2026US 12,650,445 B2Microtest S.p.A.
- Probe head with an improved configuration24 Sep 2026US 2026/0287615 A1Technoprobe S.P.A.
- Apparatus for testing an electronic device20 Aug 2026US 2026/0243803 A1JCET STATS ChipPAC Korea Limited
- Probe and electrical connection apparatus16 Jul 2026US 2026/0202442 A1Kabushiki Kaisha Nihon Micronics
- Probe head with improved cooling system16 Jul 2026US 2026/0202443 A1Technoprobe S.P.A.
- Improved vertical probe head16 Jul 2026US 2026/0202468 A1Technoprobe S.P.A.
Most cited
By later US patents
- Three dimensional high performance interconnection package422US 5,371,654 AInternational Business Machines Corporation · 1994
- Test probe for high density integrated circuits, methods of fabrication thereof and methods of use thereof284US 5,821,763 AInternational Business Machines Corporation · 1998
- Method of forming a three dimensional high performance interconnection package271US 5,531,022 AInternational Business Machines Corporation · 1996
- Test probe having elongated conductor embedded in an elostomeric material which is mounted on a space transformer256US 5,635,846 AInternational Business Machines Corporation · 1997
- High density integrated circuit apparatus, test probe and methods of use thereof207US 6,334,247 B12002