G01R 1/06733
Geometry aspects
Official title: {Geometry aspects (G01R1/06727 takes precedence)}
G01R1/06733 (Geometry aspects) appears on 1,114 US grants and 1,420 published applications in this corpus.
Search patents in G01R- Granted patents
- 1,114
- Published applications
- 1,420
- Assignees
- 420
- Inventors
- 1,830
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 4 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 4 | 0 |
| 1989 | 2 | 0 |
| 1990 | 3 | 0 |
| 1991 | 2 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 3 | 0 |
| 1995 | 5 | 0 |
| 1996 | 6 | 0 |
| 1997 | 6 | 0 |
| 1998 | 21 | 0 |
| 1999 | 13 | 0 |
| 2000 | 20 | 0 |
| 2001 | 36 | 32 |
| 2002 | 36 | 49 |
| 2003 | 49 | 45 |
| 2004 | 46 | 37 |
| 2005 | 37 | 54 |
| 2006 | 40 | 52 |
| 2007 | 46 | 63 |
| 2008 | 37 | 110 |
| 2009 | 48 | 58 |
| 2010 | 51 | 63 |
| 2011 | 35 | 42 |
| 2012 | 35 | 39 |
| 2013 | 28 | 39 |
| 2014 | 28 | 50 |
| 2015 | 40 | 39 |
| 2016 | 37 | 26 |
| 2017 | 36 | 31 |
| 2018 | 36 | 39 |
| 2019 | 33 | 60 |
| 2020 | 48 | 51 |
| 2021 | 47 | 48 |
| 2022 | 39 | 39 |
| 2023 | 24 | 59 |
| 2024 | 55 | 85 |
| 2025 | 34 | 52 |
| 2026 | 34 | 158 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Probe head including a probe supported by a tapered hole6 Oct 2026US 12,754,210 B2Yokowo Co., Ltd.
- Probe pin and probe card15 Sep 2026US 12,736,561 B2Japan Electronic Materials Corporation
- Measurement unit8 Sep 2026US 12,730,128 B2NHK Spring Co., Ltd.
- Probe25 Aug 2026US 12,716,915 B2Kabushiki Kaisha Nihon Micronics
- Replaceable insulator collars for semiconductor test systems18 Aug 2026US 12,710,448 B2Xcerra Corporation
- Cantilever holder structure with attached electrical components for a cantilever-card assembly and methods of forming the same8 Oct 2026US 2026/0309748 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Probe8 Oct 2026US 2026/0309749 A1Kabushiki Kaisha Nihon Micronics
- A probe head having high frequency performances1 Oct 2026US 2026/0298979 A1Technoprobe S.P.A.
- Mems probe needle structure and related methods1 Oct 2026US 2026/0298981 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Charge and discharge pin for secondary battery and probe for charge and discharge test of secondary battery including charge and discharge pin1 Oct 2026US 2026/0299024 A1Samsung SDI.Co., Ltd.
Most cited
By later US patents
- Three dimensional high performance interconnection package422US 5,371,654 AInternational Business Machines Corporation · 1994
- Methods of assembling microelectronic assembly with socket for engaging bump leads327US 5,802,699 ATessera, Inc. · 1998
- Method for fabricating a self limiting silicon based interconnect for testing bare semiconductor dice295US 5,483,741 AMicron Technology, Inc. · 1996
- Test probe for high density integrated circuits, methods of fabrication thereof and methods of use thereof284US 5,821,763 AInternational Business Machines Corporation · 1998
- Method of forming a three dimensional high performance interconnection package271US 5,531,022 AInternational Business Machines Corporation · 1996