G01R 1/06744
Microprobes, i.e. having dimensions as ic details
Official title: {Microprobes, i.e. having dimensions as IC details}
G01R1/06744 (Microprobes, i.e. having dimensions as ic details) appears on 231 US grants and 322 published applications in this corpus.
Search patents in G01R- Granted patents
- 231
- Published applications
- 322
- Assignees
- 113
- Inventors
- 436
- Latest grant
- 7 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 2 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 3 | 0 |
| 1998 | 4 | 0 |
| 1999 | 4 | 0 |
| 2000 | 4 | 0 |
| 2001 | 10 | 5 |
| 2002 | 11 | 13 |
| 2003 | 7 | 11 |
| 2004 | 6 | 9 |
| 2005 | 8 | 13 |
| 2006 | 9 | 17 |
| 2007 | 14 | 20 |
| 2008 | 6 | 51 |
| 2009 | 16 | 14 |
| 2010 | 9 | 26 |
| 2011 | 8 | 13 |
| 2012 | 13 | 12 |
| 2013 | 7 | 11 |
| 2014 | 10 | 16 |
| 2015 | 9 | 8 |
| 2016 | 8 | 5 |
| 2017 | 7 | 5 |
| 2018 | 7 | 5 |
| 2019 | 8 | 9 |
| 2020 | 6 | 9 |
| 2021 | 7 | 5 |
| 2022 | 5 | 3 |
| 2023 | 4 | 13 |
| 2024 | 8 | 21 |
| 2025 | 7 | 2 |
| 2026 | 3 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Spring probe assembly for a Kelvin testing system7 Apr 2026US 12,596,136 B2Johnstech International Corporation
- Cantilever probe card device and micro electro mechanical system (MEMS) probe31 Mar 2026US 12,590,990 B2Chunghwa Precision Test Tech. Co., Ltd.
- Techniques for detecting probe landing in integrated circuit testing systems10 Feb 2026US 12,546,819 B2FEI Company
- Contact probe11 Nov 2025US 12,467,948 B2Enplas Corporation
- Probe card device5 Aug 2025US 12,379,399 B2Princo Corp.
- Probe module and microprobe system comprising same17 Sep 2026US 2026/0276673 A1Nextron Corporation
- Vertical mems probe having tethering structure and manufacturing method thereof2 Jul 2026US 2026/0186021 A1Withmems Co., Ltd.
- Mems probe card with upper and lower stoppers2 Jul 2026US 2026/0186024 A1SDA Co., Ltd.
- Microstructure inspection device and system and use of the same26 Mar 2026US 2026/0086115 A1Silex Microsystems AB
- Probe cards and methods related thereto19 Feb 2026US 2026/0050009 A1
Most cited
By later US patents
- Lithographic contact elements265US 6,255,126 B1FormFactor, Inc. · 2001
- Soldering with resilient contacts217US 5,980,270 ATessera, Inc. · 1999
- Semiconductor probe card having resistance measuring circuitry and method fabrication190US 6,181,144 B2Micron Technology, Inc. · 2001
- Microelectronic spring contact element and electronic component having a plurality of spring contact elements182US 6,482,013 B2FormFactor, Inc. · 2002
- Soldering with resilient contacts176US 5,615,824 ATessera, Inc. · 1997