G01R 1/06711
Probe needles
Official title: {Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins}
G01R1/06711 (Probe needles) appears on 2,285 US grants and 2,652 published applications in this corpus.
Search patents in G01R- Granted patents
- 2,285
- Published applications
- 2,652
- Assignees
- 726
- Inventors
- 3,440
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 2 | 0 |
| 1982 | 2 | 0 |
| 1983 | 5 | 0 |
| 1984 | 3 | 0 |
| 1985 | 3 | 0 |
| 1986 | 2 | 0 |
| 1987 | 6 | 0 |
| 1988 | 8 | 0 |
| 1989 | 9 | 0 |
| 1990 | 8 | 0 |
| 1991 | 14 | 0 |
| 1992 | 6 | 0 |
| 1993 | 10 | 0 |
| 1994 | 5 | 0 |
| 1995 | 12 | 0 |
| 1996 | 19 | 0 |
| 1997 | 20 | 0 |
| 1998 | 36 | 0 |
| 1999 | 30 | 0 |
| 2000 | 39 | 0 |
| 2001 | 68 | 47 |
| 2002 | 72 | 86 |
| 2003 | 78 | 78 |
| 2004 | 86 | 84 |
| 2005 | 73 | 115 |
| 2006 | 97 | 126 |
| 2007 | 86 | 115 |
| 2008 | 83 | 183 |
| 2009 | 101 | 101 |
| 2010 | 105 | 119 |
| 2011 | 66 | 87 |
| 2012 | 65 | 70 |
| 2013 | 62 | 70 |
| 2014 | 51 | 110 |
| 2015 | 71 | 66 |
| 2016 | 72 | 75 |
| 2017 | 80 | 79 |
| 2018 | 81 | 83 |
| 2019 | 77 | 119 |
| 2020 | 102 | 101 |
| 2021 | 88 | 102 |
| 2022 | 93 | 91 |
| 2023 | 59 | 100 |
| 2024 | 95 | 147 |
| 2025 | 62 | 91 |
| 2026 | 66 | 207 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Probe head including a probe supported by a tapered hole6 Oct 2026US 12,754,210 B2Yokowo Co., Ltd.
- System and method for automatic probe card replacement22 Sep 2026US 12,742,797 B1InZiv Ltd.
- Probe mounting structure and reliability test system for wafer-level reliability test22 Sep 2026US 12,742,814 B2Semight Instruments Co., Ltd
- Electrically conductive contact pin and manufacturing method therefor15 Sep 2026US 12,736,560 B2Point Engineering Co., Ltd.
- Probe pin and probe card15 Sep 2026US 12,736,561 B2Japan Electronic Materials Corporation
- Cantilever holder structure with attached electrical components for a cantilever-card assembly and methods of forming the same8 Oct 2026US 2026/0309748 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Probe8 Oct 2026US 2026/0309749 A1Kabushiki Kaisha Nihon Micronics
- Alloy material and contact probe1 Oct 2026US 2026/0297706 A1NHK Spring Co., Ltd.
- Probe head with contact probes having an improved configuration1 Oct 2026US 2026/0298977 A1Technoprobe S.P.A.
- Probe apparatus1 Oct 2026US 2026/0298978 A1Kabushiki Kaisha Nihon Micronics
Most cited
By later US patents
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Three dimensional high performance interconnection package422US 5,371,654 AInternational Business Machines Corporation · 1994
- Flexible contact structure with an electrically conductive shell340US 5,917,707 AFormFactor, Inc. · 1999
- Method of fabricating an interconnection element335US 6,336,269 B12002