G01R 1/06755
Material aspects
Official title: {Material aspects}
G01R1/06755 (Material aspects) appears on 486 US grants and 574 published applications in this corpus.
Search patents in G01R- Granted patents
- 486
- Published applications
- 574
- Assignees
- 232
- Inventors
- 963
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 3 | 0 |
| 1994 | 1 | 0 |
| 1995 | 4 | 0 |
| 1996 | 2 | 0 |
| 1997 | 8 | 0 |
| 1998 | 10 | 0 |
| 1999 | 14 | 0 |
| 2000 | 9 | 0 |
| 2001 | 20 | 12 |
| 2002 | 17 | 26 |
| 2003 | 23 | 14 |
| 2004 | 18 | 19 |
| 2005 | 9 | 15 |
| 2006 | 20 | 20 |
| 2007 | 17 | 24 |
| 2008 | 15 | 27 |
| 2009 | 19 | 23 |
| 2010 | 18 | 22 |
| 2011 | 14 | 23 |
| 2012 | 12 | 13 |
| 2013 | 13 | 18 |
| 2014 | 13 | 19 |
| 2015 | 11 | 13 |
| 2016 | 13 | 16 |
| 2017 | 15 | 17 |
| 2018 | 15 | 17 |
| 2019 | 16 | 30 |
| 2020 | 23 | 22 |
| 2021 | 18 | 23 |
| 2022 | 23 | 16 |
| 2023 | 18 | 30 |
| 2024 | 22 | 47 |
| 2025 | 19 | 26 |
| 2026 | 13 | 42 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Electrically conductive contact pin and manufacturing method therefor15 Sep 2026US 12,736,560 B2Point Engineering Co., Ltd.
- Probe pin and probe card15 Sep 2026US 12,736,561 B2Japan Electronic Materials Corporation
- Probe25 Aug 2026US 12,716,915 B2Kabushiki Kaisha Nihon Micronics
- Probe system for testing of devices under test integrated on a semiconductor wafer, and probe card, probe head, and guiding plate structure therein18 Aug 2026US 12,710,449 B2Mpi Corporation
- Inspection device using electrically conductive contact pin11 Aug 2026US 12,704,527 B2Point Engineering Co., Ltd.
- Probe8 Oct 2026US 2026/0309749 A1Kabushiki Kaisha Nihon Micronics
- Alloy material and contact probe1 Oct 2026US 2026/0297706 A1NHK Spring Co., Ltd.
- Mems probe needle structure and related methods1 Oct 2026US 2026/0298981 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Probe head for testing semiconductor devices24 Sep 2026US 2026/0287650 A1Tse Co., Ltd.
- Probe for use in a probe system for probing a superconductive circuit, method of probing and of manufacturing a probe10 Sep 2026US 2026/0266871 A1Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
Most cited
By later US patents
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Flexible contact structure with an electrically conductive shell340US 5,917,707 AFormFactor, Inc. · 1999
- Method of fabricating an interconnection element335US 6,336,269 B12002
- Lithographic contact elements265US 6,255,126 B1FormFactor, Inc. · 2001
- High density cantilevered probe for electronic devices262US 5,811,982 AInternational Business Machines Corporation · 1998