G01R 1/06761
Related to layers
Official title: {related to layers}
G01R1/06761 (Related to layers) appears on 258 US grants and 285 published applications in this corpus.
Search patents in G01R- Granted patents
- 258
- Published applications
- 285
- Assignees
- 130
- Inventors
- 487
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 0 | 0 |
| 1995 | 3 | 0 |
| 1996 | 2 | 0 |
| 1997 | 7 | 0 |
| 1998 | 7 | 0 |
| 1999 | 11 | 0 |
| 2000 | 7 | 0 |
| 2001 | 18 | 9 |
| 2002 | 11 | 17 |
| 2003 | 18 | 10 |
| 2004 | 11 | 8 |
| 2005 | 4 | 6 |
| 2006 | 12 | 9 |
| 2007 | 7 | 9 |
| 2008 | 5 | 9 |
| 2009 | 5 | 8 |
| 2010 | 6 | 11 |
| 2011 | 6 | 11 |
| 2012 | 7 | 2 |
| 2013 | 5 | 7 |
| 2014 | 3 | 9 |
| 2015 | 6 | 7 |
| 2016 | 4 | 7 |
| 2017 | 8 | 13 |
| 2018 | 6 | 9 |
| 2019 | 10 | 10 |
| 2020 | 10 | 11 |
| 2021 | 8 | 10 |
| 2022 | 10 | 9 |
| 2023 | 9 | 17 |
| 2024 | 13 | 31 |
| 2025 | 9 | 14 |
| 2026 | 7 | 22 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electrically conductive contact pin and manufacturing method therefor15 Sep 2026US 12,736,560 B2Point Engineering Co., Ltd.
- Probe pin and probe card15 Sep 2026US 12,736,561 B2Japan Electronic Materials Corporation
- Inspection device using electrically conductive contact pin11 Aug 2026US 12,704,527 B2Point Engineering Co., Ltd.
- Strip-shaped composite material for probe needles7 Jul 2026US 12,674,818 B2Heraeus Deutschland GmbH & Co. KG
- Vertical probe card5 May 2026US 12,618,870 B2Point Engineering Co., Ltd.
- Probe8 Oct 2026US 2026/0309749 A1Kabushiki Kaisha Nihon Micronics
- Mems probe needle structure and related methods1 Oct 2026US 2026/0298981 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Probe head for testing semiconductor devices24 Sep 2026US 2026/0287650 A1Tse Co., Ltd.
- Probe for use in a probe system for probing a superconductive circuit, method of probing and of manufacturing a probe10 Sep 2026US 2026/0266871 A1Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Microelectronic devices fabricated with 3d lithography20 Aug 2026US 2026/0242205 A1Atum Works Inc.
Most cited
By later US patents
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Flexible contact structure with an electrically conductive shell340US 5,917,707 AFormFactor, Inc. · 1999
- Method of fabricating an interconnection element335US 6,336,269 B12002
- Lithographic contact elements265US 6,255,126 B1FormFactor, Inc. · 2001
- Method of modifying the thickness of a plating on a member by creating a temperature gradient on the member, applications for employing such a method, and structures resulting from such a method200US 6,110,823 AFormFactor, Inc. · 2000