US 6,110,823 A · Method of modifying the thickness of a plating on a member by creating a temperature gradient on the member, applications for employing such a method, and structures resulting from such a method

Abstract

Contact structures exhibiting resilience or compliance for a variety of electronic components are formed by bonding a free end of a wire to a substrate, configuring thw wire into a wire stem having a springable shape, serving thw wire stem, and overcoating the wire stem with at least one layer of a material chosen primarily for its structural (resiliency, compliance) characteristics. A variety of techniques for configuring, serving, and overcoating the wire stem are disclosed. In an exemplary embodiment, a free end of a wire stem is bonded to a contact area on a substrate, the wire stem is configured to ahve a springable shape, the wire stem is served to be free-standing by an electrical discharge, and the free-standing wire stem is overcoating by plating.

Claims40

Dependent claims

A method of tailoring the thickness of a plating, comprising:

disposing at least a section of a member to be plated in a single plating bath;
and
creating a temperature gradient on the section that is in the single plating bath, while plating the section.

Dependencies are inferred from the claim text.

Facts

Application

09/089,817Filed 3 Jun 1998 · division

Priority

16 Nov 1993

Granted

29 Aug 2000

Term ends

Not estimatedThe source records don’t support an estimate.

Classification79 codes

H05K 7/1069
Co-operating by abutting: with spring contact pieces
B23K 20/004
Specially adapted for particular articles or work: wire welding
C23C 18/168
Process conditions: control of temperature, e.g. temperature of bath, substrate
H05K 3/24
Secondary treatment of printed circuits: reinforcing of the conductive pattern

Family

Serial512,812Parent of this continuation-in-part · filed 16 Nov 1993

Serial340,144Parent of this continuation-in-part · filed 15 Nov 1994

PCTUS9413373Parent of this continuation-in-part · filed 16 Nov 1994

Serial452,255Parent of this division · filed 26 May 1995

US 6,110,823 AThis patent

From the US filing history. Foreign family members aren’t listed.

Method of modifying the thickness of a plating on a member by creating a temperature gradient on the member, applications for employing such a method, and structures resulting from such a method

Life of this patent

Method of modifying the thickness of a plating on a member by creating a temperature gradient on the member, applications for employing such a method, and structures resulting from such a method

Life of this patent

Abstract

Claims40