Probe head for testing semiconductor devices

Abstract

Disclosed is a probe head for testing semiconductor devices, the probe head including an upper guide plate having an upper receiving hole formed therein, a lower guide plate formed spaced apart from the upper guide plate, the lower guide plate having a lower receiving hole formed therein, and a probe coupled to the upper guide plate and the lower guide plate such that an upper part and a lower part are received in the upper receiving hole and the lower receiving hole, respectively, and a body is located between the upper guide plate and the lower guide plate, wherein the upper part of the probe has a displacement portion formed by displacement of a central axis of the probe along a Z-axis, and the displacement portion generates side reaction force on the upper guide plate.

Dependencies are inferred from the claim text.