Point Engineering Co., Ltd.
Chungcheongnam-do, KR· latest recorded location
POINT ENGINEERING CO., LTD. is named on 106 US grants and 191 published applications in this corpus. Its most frequent classification is H10H (Inorganic light-emitting semiconductor devices having potential barriers).
- Granted patents
- 106
- Published applications
- 191
- Inventors
- 23
- Granted in 2026 so far
- 9
- Most recent grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2008 | 0 | 1 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 1 |
| 2014 | 1 | 4 |
| 2015 | 2 | 14 |
| 2016 | 8 | 18 |
| 2017 | 15 | 12 |
| 2018 | 10 | 10 |
| 2019 | 5 | 22 |
| 2020 | 13 | 21 |
| 2021 | 13 | 24 |
| 2022 | 10 | 9 |
| 2023 | 9 | 9 |
| 2024 | 6 | 23 |
| 2025 | 5 | 16 |
| 2026 | 9 | 7 |
By publication year. 2026 runs to 8 Oct.
Technology areas
Share of 297 documents
- H10HInorganic light-emitting semiconductor devices having potential barriers126
- H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by113
- G01RMeasuring electric variables74
- H10PGeneric processes or apparatus for the manufacture or treatment of devices covered49
- H05KPrinted circuits45
- C25DProcesses for the electrolytic or electrophoretic production of coatings24
- G01NInvestigating or analysing materials by determining their chemical or physical properties22
- C23CCoating metallic material19
- Y10TTechnical subjects covered by former us classification17
- B32BLayered products, i.e. products built-up of strata of flat or non-flat15
Recent patents
- Electrically conductive contact pin and manufacturing method therefor15 Sep 2026US 12,736,560 B2
- Inspection device using electrically conductive contact pin11 Aug 2026US 12,704,527 B2
- Electrically conductive contact pin14 Jul 2026US 12,681,043 B2
- Electrically conductive contact pin26 May 2026US 12,638,474 B2
- Vertical probe card5 May 2026US 12,618,870 B2
- Capacitor component and integrated circuit chip package including same23 Jul 2026US 2026/0213079 A1
- Metal molded product21 May 2026US 2026/0140142 A1
- Electrically conductive contact pin26 Mar 2026US 2026/0086116 A1
- Electrically conductive contact pin26 Mar 2026US 2026/0086117 A1
- Electrically conductive contact pin26 Feb 2026US 2026/0056232 A1
Most cited
By later US patents
- Semiconductor probe pin8US D1,030,689 S12024 · Design
- Semiconductor probe pin6US D1,051,865 S12024 · Design
- Optical device and method for manufacturing same5US 8,921,879 B22014
- Micro LED structure and method of manufacturing same4US 10,886,446 B22021
- Micro heater and micro sensor and manufacturing methods thereof3US 10,015,841 B22018