Capacitor component and integrated circuit chip package including same

A capacitor component comprising:

• an anodized membrane body having a plurality of pores;
• a first upper electrode layer comprising a first upper surface electrode part formed on an upper surface of the anodized membrane body and a first upper pore electrode part formed on a portion of an upper inner wall of the pores;
• an upper dielectric layer comprising an upper surface dielectric part formed on the first upper surface electrode part and an upper pore dielectric part formed on the first upper pore electrode part;
• a second upper electrode layer comprising a second upper surface electrode part formed on the upper surface dielectric part and a second upper pore electrode part formed on the upper pore dielectric part;
• a first lower electrode layer comprising a first lower surface electrode part formed on a lower surface of the anodized membrane body and a first lower pore electrode part formed on a portion of a lower inner wall of the pores;
• a lower dielectric layer comprising a lower surface dielectric part formed on the first lower surface electrode part and a lower pore dielectric part formed on the first lower pore electrode part;
• and
• a second lower electrode layer comprising a second lower surface electrode part formed on the lower surface dielectric part and a second lower pore electrode part formed on the lower pore dielectric part.

An integrated circuit chip package comprising:

• a package substrate;
• a semiconductor chip mounted on the package substrate;
• a molding part protecting the semiconductor chip;
• and
• a capacitor component provided inside or on the package substrate,
• wherein the capacitor component comprises:
• an anodized membrane body having a plurality of pores;
• a first electrode layer comprising a first surface electrode part formed on a surface of the anodized membrane body and a first pore electrode part formed on an inner wall of the pores;
• a dielectric layer comprising a surface dielectric part formed on the first surface electrode part and a pore dielectric part formed on the first pore electrode part;
• and
• a second electrode layer comprising a second surface electrode part formed on the surface dielectric part and a second pore electrode part formed on the pore dielectric part.