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US 10,886,446 B2Granted
Micro LED structure and method of manufacturing same
AssigneePoint Engineering Co., Ltd.
InventorsBum Mo Ahn, Seung Ho Park, Sung Hyun Byun
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Abstract
The present invention relates generally to a micro LED structure and a method of manufacturing the same, and more particularly to a micro LED structure having an anisotropic conductive film between a micro LED and a target substrate to which the micro LED is bonded for electrically connect the micro LED and the target substrate together, and a method of manufacturing the same.
Claims1
A micro light-emitting diode (LED) structure comprising:
- a micro LED;
- a target substrate to which the micro LED is bonded;
- and
- an anisotropic conductive film provided between the micro LED and the target substrate,
- wherein the anisotropic conductive film includes:
- an insulating porous film of elastic material including a plurality of holes, wherein the plurality of holes are vertically formed, the plurality of holes are irregularly formed with different separation distances, and each of the plurality of holes is independently formed;
- and
- a conductive material electrically connecting the micro LED and the target substrate together,
- wherein the plurality of holes includes a first plurality of holes in an electrical contact area of the micro LED that are filled with the conductive material and a second plurality of holes in a non-electrical contact area of the micro LED that are not filled with the conductive material, and wherein the conductive material fills the first plurality of holes using a masking process.
6 more elements
Dependencies are inferred from the claim text.