Cantilever probe card device and micro electro mechanical system (MEMS) probe

A micro electro mechanical system (MEMS) probe, comprising:

• an arm segment;
• a main segment located at one side of the arm segment, wherein the main segment defines a layout region arranged inside of an outer contour thereof, and the main segment has a soldering end portion and an extending end portion respectively located at two opposite sides of the layout region along a predetermined direction;
• and
• a testing segment having an upright shape along the predetermined direction and connected to another side of the arm segment;
• wherein the layout region has a plurality of thru-holes that occupy 3% to 70% of a region surroundingly defined by the outer contour, and wherein the layout region is spaced apart from the outer contour by a layout spacing that is greater than or equal to an inner diameter of any one of the thru-holes,
• wherein the MEMS probe includes a plurality of supporting arms and a plurality of organic insulation layers that respectively cover the supporting arms, wherein the thru-holes are in a matrix arrangement having a plurality of rows, and the thru-holes in one of the rows are arranged adjacent to the soldering end portion and are each defined as a solder receiving hole, and wherein the supporting arms and the solder receiving holes are arranged in one row, and any two of the supporting arms adjacent to each other are provided with one of the solder receiving holes therebetween.

A cantilever probe card device, comprising:

• a substrate including a plurality of soldering pads;
• and
• a plurality of micro electro mechanical system (MEMS) probes fixed onto the substrate and each including:
• an arm segment;
• a main segment located at one side of the arm segment, wherein the main segment defines a layout region arranged inside of an outer contour thereof, and the main segment has a soldering end portion and an extending end portion respectively located at two opposite sides of the layout region along a predetermined direction;
• and
• a testing segment having an upright shape along the predetermined direction and connected to another side of the arm segment;
• wherein, in each of the MEMS probes, the layout region has a plurality of thru-holes that occupy 3% to 70% of a region surroundingly defined by the outer contour, and wherein the layout region is spaced apart from the outer contour by a layout spacing that is greater than or equal to an inner diameter of any one of the thru-holes;
• wherein the MEMS probes are fixed onto the soldering pads of the substrate through the soldering end portions of the main segments thereof,
• wherein the soldering pads include a plurality of first soldering pads and a plurality of second soldering pads, wherein the first soldering pads are arranged in a first row along an arrangement direction perpendicular to the predetermined direction, and the second soldering pads are arranged in a second row along the arrangement direction, wherein the second row is parallel to and spaced apart from the first row, and wherein each of the MEMS probes includes:
• a plurality of first probes each having the main segment, the arm segment, and the testing segment, wherein the main segment, the arm segment, and the testing segment of each of the first probes are respectively defined as a first main segment, a first arm segment, and a first testing segment;
• and
• a plurality of second probes each having:
• the main segment defined as a second main segment and having a main height along the predetermined direction;
• an extending segment connected to the second main segment, wherein the extending segment has an extension height along the predetermined direction, and wherein the extension height is within a range from 5% to 80% of the main height;
• the arm segment defined as a second arm segment and connected to the extending segment;
• and
• the testing segment defined as a second testing segment, wherein the second testing segment has an upright shape along the predetermined direction and is connected to the second arm segment;
• wherein the first main segments of the first probes are fixed onto the first soldering pads, the second main segments of the second probes are fixed onto the second soldering pads, and the first testing segments of the first probes and the second testing segments of the second probes are arranged in one row along the arrangement direction;
• wherein, when the first testing segments of the first probes and the second testing segments of the second probes jointly abut against a device under test (DUT), each of the first probes is only deformed in the first arm segment, and each of the second probes is only deformed in the second arm segment.