Semiconductor probe card having resistance measuring circuitry and method fabrication

A probe card for testing a semiconductor wafer comprising:

• a substrate;
• a pair of probe contacts on the substrate configured to electrically engage a pair of interconnected wafer contacts on the wafer;
• and
• four conductors on the substrate in electrical communication with the probe contacts and configured as a Kelvin structure adapted to evaluate a contact resistance between the pair of probe contacts and the pair of wafer contacts.

A probe card for testing a semiconductor wafer having a first wafer contact electrically connected to a second wafer contact comprising:

• a substrate;
• a first resistivity contact on the substrate for electrically engaaing the first wafer contact and a second resistivity contact on the substrate for electrically engaging the second wafer contact;
• a source high conductor and a sense high conductor on the substrate in electrical communication with the first resistivity contact;
• and
• a source low conductor and a sense low conductor on the substrate in electrical communication with the second resistivity contact;
• the source high conductor, the source low conductor, the sense high conductor, and the sense low conductor configured for use with a resistivity measuring circuit to evaluate a contact resistance between the first resistivity contact and the first wafer contact or between the second resistivity contact and the second wafer contact.

A probe card for testing a semiconductor wafer having two interconnected wafer contacts comprising:

• a substrate;
• two probe contacts on the substrate configured to electrically engage the two wafer contacts;
• and
• four conductors on the substrate in electrical communication with the two probe contacts and configured for electrical communication with a resistivity measuring circuit for evaluating a contact resistance between the two probe contacts and the two wafer contacts.