G01R 1/06738
Related to tip portion
Official title: {related to tip portion}
G01R1/06738 (Related to tip portion) appears on 525 US grants and 573 published applications in this corpus.
Search patents in G01R- Granted patents
- 525
- Published applications
- 573
- Assignees
- 236
- Inventors
- 906
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 2 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 2 | 0 |
| 1995 | 5 | 0 |
| 1996 | 4 | 0 |
| 1997 | 2 | 0 |
| 1998 | 12 | 0 |
| 1999 | 6 | 0 |
| 2000 | 7 | 0 |
| 2001 | 16 | 17 |
| 2002 | 21 | 21 |
| 2003 | 29 | 21 |
| 2004 | 25 | 16 |
| 2005 | 15 | 19 |
| 2006 | 14 | 20 |
| 2007 | 25 | 32 |
| 2008 | 13 | 28 |
| 2009 | 15 | 23 |
| 2010 | 23 | 16 |
| 2011 | 16 | 11 |
| 2012 | 14 | 19 |
| 2013 | 8 | 22 |
| 2014 | 14 | 21 |
| 2015 | 19 | 19 |
| 2016 | 17 | 11 |
| 2017 | 22 | 24 |
| 2018 | 17 | 14 |
| 2019 | 16 | 28 |
| 2020 | 26 | 23 |
| 2021 | 20 | 20 |
| 2022 | 18 | 19 |
| 2023 | 9 | 31 |
| 2024 | 30 | 40 |
| 2025 | 20 | 28 |
| 2026 | 10 | 30 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Probe25 Aug 2026US 12,716,915 B2Kabushiki Kaisha Nihon Micronics
- Test needle, test probe, and flying probe tester for testing printed circuit boards9 Jun 2026US 12,650,464 B2Atg Mycronic GmbH
- Testing device and method, and non-transitory computer-readable recording medium26 May 2026US 12,638,494 B2Tokyo Electron Limited
- Probe device, probe system including the probe device and operating method thereof12 May 2026US 12,625,164 B2Star Technologies Inc.
- Vertical probe card5 May 2026US 12,618,870 B2Point Engineering Co., Ltd.
- Probe8 Oct 2026US 2026/0309749 A1Kabushiki Kaisha Nihon Micronics
- Probe head with an improved configuration24 Sep 2026US 2026/0287615 A1Technoprobe S.P.A.
- Probe for use in a probe system for probing a superconductive circuit, method of probing and of manufacturing a probe10 Sep 2026US 2026/0266871 A1Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Electrical contactor and method of manufacturing electrical contactor27 Aug 2026US 2026/0251682 A1Kabushiki Kaisha Nihon Micronics
- Testing device and its pogo probe device13 Aug 2026US 2026/0235645 A1Global Unichip Corporation
Most cited
By later US patents
- Method for fabricating a self limiting silicon based interconnect for testing bare semiconductor dice295US 5,483,741 AMicron Technology, Inc. · 1996
- High density cantilevered probe for electronic devices262US 5,811,982 AInternational Business Machines Corporation · 1998
- Soldering with resilient contacts217US 5,980,270 ATessera, Inc. · 1999
- Process for manufacturing a semiconductor package with bi-substrate die214US 5,946,553 AMicron Technology, Inc. · 1999
- Semiconductor package with bi-substrate die184US 6,020,624 AMicron Technology, Inc. · 2000