G01R 1/0675
Needle-like
Official title: {Needle-like}
G01R1/0675 (Needle-like) appears on 132 US grants and 218 published applications in this corpus.
Search patents in G01R- Granted patents
- 132
- Published applications
- 218
- Assignees
- 93
- Inventors
- 326
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 2 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 2 | 0 |
| 1997 | 2 | 0 |
| 1998 | 2 | 0 |
| 1999 | 0 | 0 |
| 2000 | 2 | 0 |
| 2001 | 6 | 4 |
| 2002 | 5 | 11 |
| 2003 | 8 | 6 |
| 2004 | 4 | 5 |
| 2005 | 4 | 7 |
| 2006 | 5 | 3 |
| 2007 | 4 | 4 |
| 2008 | 3 | 45 |
| 2009 | 3 | 10 |
| 2010 | 6 | 12 |
| 2011 | 3 | 0 |
| 2012 | 3 | 1 |
| 2013 | 2 | 3 |
| 2014 | 4 | 4 |
| 2015 | 1 | 2 |
| 2016 | 3 | 2 |
| 2017 | 2 | 2 |
| 2018 | 2 | 4 |
| 2019 | 1 | 9 |
| 2020 | 9 | 12 |
| 2021 | 5 | 13 |
| 2022 | 13 | 11 |
| 2023 | 5 | 8 |
| 2024 | 8 | 12 |
| 2025 | 5 | 12 |
| 2026 | 5 | 16 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor wafer14 Jul 2026US 12,681,073 B2Nanya Technology Corporation
- Electronic device having contact pads for testing and mounting electronic component and test method for electronic device19 May 2026US 12,631,679 B2Carux Technology Pte. Ltd.
- Test pin structure31 Mar 2026US 12,590,989 B2
- Automatic calibration method and automatic calibration equipment for testing probe set used in semiconductor process31 Mar 2026US 12,591,032 B2United Microelectronics Corp.
- Probe system with integrated choke inductor27 Jan 2026US 12,535,501 B2Northrop Grumman Systems Corporation
- Cantilever holder structure with attached electrical components for a cantilever-card assembly and methods of forming the same8 Oct 2026US 2026/0309748 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Mems probe needle structure and related methods1 Oct 2026US 2026/0298981 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Probe having low balance contact force27 Aug 2026US 2026/0251678 A1Xingr Technologies (Zhejiang) Limited
- Probe support assembly including a piezoelectric sensor array for alignment of a probe card assembly and methods of operating and forming the same27 Aug 2026US 2026/0251704 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Probe head for a testing apparatus of electronic devices16 Jul 2026US 2026/0202439 A1Technoprobe S.P.A.
Most cited
By later US patents
- Three dimensional high performance interconnection package422US 5,371,654 AInternational Business Machines Corporation · 1994
- Test probe for high density integrated circuits, methods of fabrication thereof and methods of use thereof284US 5,821,763 AInternational Business Machines Corporation · 1998
- Method of forming a three dimensional high performance interconnection package271US 5,531,022 AInternational Business Machines Corporation · 1996
- Test probe having elongated conductor embedded in an elostomeric material which is mounted on a space transformer256US 5,635,846 AInternational Business Machines Corporation · 1997
- High density integrated circuit apparatus, test probe and methods of use thereof207US 6,334,247 B12002