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AssigneeUnited Microelectronics Corp.
InventorsZheng-Yang Li, Chia-Chan Tsai
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An automatic calibration method and an automatic calibration equipment for a testing probe set used in a semiconductor process are provided. The automatic calibration method of the test probe set used in the semiconductor manufacturing process includes the following steps. A preliminary correction offset is analyzed according to an empirical needle mark of the test probe set. A relative position between the test probe set and a wafer to be tested are preliminarily adjusted according to the preliminary correction offset. The test probe set is used to perform a test procedure on the wafer to be tested. Whether the offset of the test probe set is within a predetermined specification is determined. If the offset of the test probe set exceeds the predetermined specification, the relative position between the test probe set and the wafer to be tested is further adjusted.
An automatic calibration method for a testing probe set used in a semiconductor process, comprising:
An automatic calibration equipment for a testing probe set used in a semiconductor process, comprising:
Dependencies are inferred from the claim text.