H10W 90/796
Between a chip and a stacked lead frame, conducting package substrate or
Official title: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
H10W90/796 (Between a chip and a stacked lead frame, conducting package substrate or) appears on 84 US grants and 182 published applications in this corpus.
Search patents in H10W- Granted patents
- 84
- Published applications
- 182
- Assignees
- 87
- Inventors
- 415
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 1 |
| 2009 | 0 | 1 |
| 2010 | 1 | 0 |
| 2011 | 0 | 1 |
| 2012 | 1 | 0 |
| 2013 | 1 | 2 |
| 2014 | 2 | 7 |
| 2015 | 6 | 4 |
| 2016 | 2 | 4 |
| 2017 | 7 | 5 |
| 2018 | 4 | 8 |
| 2019 | 3 | 7 |
| 2020 | 7 | 11 |
| 2021 | 4 | 7 |
| 2022 | 7 | 11 |
| 2023 | 2 | 17 |
| 2024 | 13 | 29 |
| 2025 | 11 | 47 |
| 2026 | 12 | 20 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Method of assembly by direct bonding of electronic components25 Aug 2026US 12,721,248 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Chip package structure28 Jul 2026US 12,696,772 B2Tong Hsing Electronic Industries, Ltd.
- Surface mount package having an internal redundant electrical connection28 Jul 2026US 12,696,824 B2Infineon Technologies Austria AG
- Semiconductor device and method of manufacturing the same16 Jun 2026US 12,660,658 B2AOI Electronics Co., Ltd.
- Two-sided liquid cooling5 May 2026US 12,622,272 B1Adeia Semiconductor Bonding Technologies Inc.
- Two-sided liquid cooling8 Oct 2026US 2026/0314413 A1Adeia Semiconductor Bonding Technologies Inc.
- Embedded cooling systems for advanced device packaging27 Aug 2026US 2026/0255962 A1Adeia Semiconductor Bonding Technologies Inc.
- Liquid and air combo cooling for multi-chip modules27 Aug 2026US 2026/0255963 A1Adeia Semiconductor Bonding Technologies Inc.
- Liquid cooling module20 Aug 2026US 2026/0248011 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Liquid cooling to cpu/mcm bond and package process flow13 Aug 2026US 2026/0239976 A1Adeia Semiconductor Bonding Technologies Inc.
Most cited
By later US patents
- Low temperature bonded structures178US 10,790,262 B2Invensas Bonding Technologies, Inc. · 2020
- Semiconductor device and method for fabricating the same114US 6,306,731 B1Oki Electric Industry Co., Ltd. · 2001
- Semiconductor chip having TSV (through silicon via) and stacked assembly including the chips21US 7,838,967 B2Powertech Technology Inc. · 2010
- Low temperature bonded structures11US 11,515,279 B2Adeia Semiconductor Bonding Technologies Inc. · 2022
- Package structure and method of manufacturing the same6US 11,233,035 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2022