Semiconductor chip having TSV (through silicon via) and stacked assembly including the chips

A stacked assembly comprising a plurality of semiconductor chips vertically stacked on each other and a carrier, each semiconductor chip comprising:

• a semiconductor substrate having a first surface, a corresponding second surface, a plurality of through holes penetrating from the first surface to the second surface;
• a plurality of first bonding pads disposed on the first surface;
• a plurality of second bonding pads disposed on the second surface and aligned with the first bonding pads, wherein the through holes further penetrate through the first bonding pads and the second bonding pads;
• a plurality of first extruded rings extrusively disposed on the first bonding pads in a manner that each first bonding pad has a first contact surface exposed on the first surface and the first contact surfaces are located between the corresponding first extruded rings and the corresponding through holes;
• and
• a plurality of second extruded rings extrusively disposed on the second bonding pads in a manner that each second bonding pad has a second contact surface exposed on the second surface and the second contact surfaces are located outside and adjacent to the corresponding second extruded rings to encircle the corresponding second extruded rings;
• wherein the second extruded rings have a dimension for inserting into the first extruded rings.

A semiconductor chip primarily comprising:

• a semiconductor substrate having a first surface, a corresponding second surface, a first blind hole in the first surface and a second blind hole in the second surface, wherein there is a horizontal displacement between the first blind hole and the second blind hole;
• a first bonding pad disposed on the first surface, wherein the first blind hole penetrates through the first bonding pad;
• a second bonding pad disposed on the second surface, wherein the second blind hole penetrates through the second bonding pad;
• a first extruded ring extrusively disposed on the first bonding pad in a manner that the first bonding pad has a first contact surface exposed on the first surface and located between the first extruded ring and the first blind hole;
• and
• a second extruded ring extrusively disposed on the second bonding pad in a manner that the second bonding pad has a second contact surface exposed on the second surface and located outside and adjacent to the second extruded ring to encircle the second extruded ring;
• wherein the second extruded ring has a dimension to fit in the first extruded ring.