Low temperature bonded structures
AssigneeInvensas Bonding Technologies, Inc.
InventorsCyprian Emeka Uzoh, Jeremy Alfred Theil, Liang Wang, Rajesh Katkar, Guilian Gao, Laura Wills Mirkarimi
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Abstract
Devices and techniques including process steps make use of recesses in conductive interconnect structures to form reliable low temperature metallic bonds. A fill layer is deposited into the recesses prior to bonding. First conductive interconnect structures are bonded at ambient temperatures to second metallic interconnect structures using direct bonding techniques, with the fill layers in the recesses in one or both of the first and second interconnect structures.
Claims13
A method, comprising:
- forming a bonding surface of a first substrate, the first substrate including a first metallic feature embedded into the bonding surface of the first substrate;
- depositing a first metallic material onto a surface of the first metallic feature;
- forming a bonding surface of a second substrate, the second substrate including a second metallic feature embedded into the bonding surface of the second substrate;
- depositing a second metallic material onto a surface of the second metallic feature;
- forming an alloy mass between the first metallic feature and the second metallic feature, the alloy mass comprising an alloy of the first and second metallic materials, wherein a concentration of the first metallic material and a concentration of the second metallic material of the alloy mass is non-linear throughout the alloy mass;
- and
- bonding the bonding surface of the second substrate to the bonding surface of the first substrate via direct bonding without adhesive.
A method, comprising:
- forming a bonding surface of a first substrate, the first substrate including a first metallic feature embedded into the bonding surface of the first substrate;
- forming a bonding surface of a second substrate, the second substrate including a second metallic feature embedded into the bonding surface of the second substrate;
- forming a discontinuous layer of a first metallic material onto a surface of the first and/or second metallic features, the first metallic material being different from a material of the first or second metallic features;
- and
- bonding the bonding surface of the second substrate to the bonding surface of the first substrate via direct bonding, and mechanically or electrically coupling the first metallic feature to the second metallic feature.
A method, comprising:
- forming a bonding surface of a first substrate, the first substrate including a first metallic feature embedded into the bonding surface of the first substrate;
- depositing a first metallic material different from a material of the first metallic feature onto a surface of the first metallic feature;
- forming a bonding surface of a second substrate, the second substrate including a second metallic feature embedded into the bonding surface of the second substrate;
- depositing a second metallic material different from a material of the second metallic feature and different from the first metallic material onto a surface of the second metallic feature;
- bonding the bonding surface of the second substrate to the bonding surface of the first substrate via direct bonding without adhesive;
- and
- mechanically and electrically coupling the first metallic feature to the second metallic feature via the first metallic material and the second metallic material.
Dependencies are inferred from the claim text.