H10W 90/791
Of direct-bonded pads
Official title: {of direct-bonded pads}
H10W90/791 (Of direct-bonded pads) appears on 4,690 US grants and 8,452 published applications in this corpus.
Search patents in H10W- Granted patents
- 4,690
- Published applications
- 8,452
- Assignees
- 623
- Inventors
- 8,419
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 5 | 4 |
| 2003 | 1 | 6 |
| 2004 | 2 | 5 |
| 2005 | 3 | 11 |
| 2006 | 4 | 8 |
| 2007 | 6 | 14 |
| 2008 | 5 | 19 |
| 2009 | 11 | 13 |
| 2010 | 14 | 28 |
| 2011 | 13 | 21 |
| 2012 | 24 | 56 |
| 2013 | 32 | 62 |
| 2014 | 59 | 85 |
| 2015 | 81 | 128 |
| 2016 | 107 | 143 |
| 2017 | 154 | 142 |
| 2018 | 136 | 186 |
| 2019 | 179 | 284 |
| 2020 | 300 | 525 |
| 2021 | 412 | 752 |
| 2022 | 538 | 941 |
| 2023 | 638 | 942 |
| 2024 | 664 | 1280 |
| 2025 | 710 | 1522 |
| 2026 | 584 | 1275 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Semiconductor package structure having a chip stack6 Oct 2026US 12,757,412 B2Changxin Memory Technologies, Inc.
- Semiconductor memory device6 Oct 2026US 12,757,413 B2Samsung Electronics Co., Ltd.
- Semiconductor device6 Oct 2026US 12,757,434 B2Samsung Electronics Co., Ltd.
- Package structure and manufacturing method thereof6 Oct 2026US 12,757,706 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device with polymer liner and method for fabricating the same6 Oct 2026US 12,757,707 B2Nanya Technology Corporation
- Interconnect structure and method of forming same8 Oct 2026US 2026/0306859 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package manufacturing methods using hybrid die bonding with spin-on siloxane materials8 Oct 2026US 2026/0308432 A1
- Semiconductor device and method of manufacturing semiconductor device8 Oct 2026US 2026/0311730 A1SK hynix Inc.
- Semiconductor devices including global bitlines8 Oct 2026US 2026/0313881 A1Samsung Electronics Co., Ltd.
- Semiconductor device including capacitors, word line pads and word line contacts8 Oct 2026US 2026/0313882 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Methods and devices for fabricating and assembling printable semiconductor elements883US 7,622,367 B1The Board of Trustees of the University of Illinois · 2009
- Stretchable semiconductor elements and stretchable electrical circuits765US 7,557,367 B2The Board of Trustees of the University of Illinois · 2009
- Process of fabricating three-dimensional semiconductor device576US 4,612,083 ANEC Corporation · 1986
- Interconnect structure for stacked semiconductor device573US 6,465,892 B1Fujitsu Limited · 2002
- 3D IC method and device388US 7,485,968 B2Ziptronix, Inc. · 2009