H10W 90/792
Between multiple chips
Official title: {between multiple chips}
H10W90/792 (Between multiple chips) appears on 3,790 US grants and 6,814 published applications in this corpus.
Search patents in H10W- Granted patents
- 3,790
- Published applications
- 6,814
- Assignees
- 432
- Inventors
- 6,463
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 3 | 2 |
| 2003 | 0 | 2 |
| 2004 | 0 | 2 |
| 2005 | 1 | 6 |
| 2006 | 2 | 3 |
| 2007 | 1 | 3 |
| 2008 | 2 | 8 |
| 2009 | 3 | 8 |
| 2010 | 10 | 22 |
| 2011 | 8 | 14 |
| 2012 | 14 | 41 |
| 2013 | 25 | 46 |
| 2014 | 45 | 56 |
| 2015 | 56 | 96 |
| 2016 | 74 | 86 |
| 2017 | 106 | 99 |
| 2018 | 100 | 131 |
| 2019 | 135 | 208 |
| 2020 | 228 | 416 |
| 2021 | 339 | 657 |
| 2022 | 464 | 796 |
| 2023 | 539 | 781 |
| 2024 | 565 | 1050 |
| 2025 | 603 | 1193 |
| 2026 | 464 | 1088 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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Most cited
By later US patents
- Process of fabricating three-dimensional semiconductor device576US 4,612,083 ANEC Corporation · 1986
- Interconnect structure for stacked semiconductor device573US 6,465,892 B1Fujitsu Limited · 2002
- Method for manufacturing an interconnect structure for stacked semiconductor device316US 6,472,293 B2Fujitsu Limited · 2002
- Semiconductor device and associated fabrication method309US 5,753,536 AMatsushita Electric Industrial Co., Ltd. · 1998
- Methods for hybrid wafer bonding271US 8,802,538 B1Taiwan Semiconductor Manufacturing Company.Ltd · 2014