H10W 90/798
Between a chip and a stacked discrete passive device
Official title: {between a chip and a stacked discrete passive device}
H10W90/798 (Between a chip and a stacked discrete passive device) appears on 107 US grants and 166 published applications in this corpus.
Search patents in H10W- Granted patents
- 107
- Published applications
- 166
- Assignees
- 49
- Inventors
- 281
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2011 | 0 | 1 |
| 2012 | 0 | 1 |
| 2013 | 0 | 2 |
| 2014 | 1 | 0 |
| 2015 | 0 | 1 |
| 2016 | 0 | 2 |
| 2017 | 5 | 7 |
| 2018 | 4 | 7 |
| 2019 | 5 | 7 |
| 2020 | 8 | 16 |
| 2021 | 9 | 17 |
| 2022 | 13 | 24 |
| 2023 | 17 | 27 |
| 2024 | 20 | 24 |
| 2025 | 16 | 17 |
| 2026 | 9 | 13 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Die interconnect structure with embedded inductor(s) including coupled coils formed in redistribution layer (RDL) and adjacent bump-level distribution layer (BDL) for improved Q factor25 Aug 2026US 12,721,157 B2QUALCOMM Incorproated
- Three-dimensional semiconductor package having a stacked passive device4 Aug 2026US 12,702,058 B2Advanced Micro Devices, Inc.
- Multichip IC devices in glass medium and including an interconnect bridge die14 Jul 2026US 12,685,194 B2Intel Corporation
- Integration of discrete embeddable capacitors on integrated circuit chips16 Jun 2026US 12,660,693 B2Murata Manufacturing Co., Ltd.
- Semiconductor device packages and methods of formation2 Jun 2026US 12,648,153 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package including power supply capacitor8 Oct 2026US 2026/0314504 A1Samsung Electronics Co., Ltd.
- Semiconductor device packages and methods of formation17 Sep 2026US 2026/0282398 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Integration of Discrete Embeddable Capacitors on Integrated Circuit Chips17 Sep 2026US 2026/0283042 A1Murata Manufacturing Co., Ltd.
- Semiconductor package6 Aug 2026US 2026/0231746 A1Samsung Electronics Co., Ltd.
- Stacked capacitor device and manufacturing method thereof30 Jul 2026US 2026/0223666 A1Winbond Electronics Corp.
Most cited
By later US patents
- Integrated voltage regulator and passive components44US 11,515,291 B2Adeia Semiconductor Inc. · 2022
- Semiconductor package and method of forming the same32US 9,768,133 B1Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Bonded structures with integrated passive component19US 11,626,363 B2Adeia Semiconductor Bonding Technologies Inc. · 2023
- Interconnect chips11US 10,720,401 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2020
- Semiconductor package and method of forming the same8US 10,026,704 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2018