Interconnect chips
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsKuo-Chiang Ting, Chi-Hsi Wu, Shang-Yun Hou, Tu-Hao Yu, Chia-Hao Hsu, Ting-Yu Yeh
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Abstract
A method includes bonding a first device die and a second device die to an interconnect die. The interconnect die includes a first portion over and bonded to the first device die, and a second portion over and bonded to the second device die. The interconnect die electrically connects the first device die to the second device die. The method further includes encapsulating the interconnect die in an encapsulating material, and forming a plurality of redistribution lines over the interconnect die.
Claims20
A package comprising
- a first device die and a second device die;
- an interconnect die bonded to the first device die and the second device die, wherein the interconnect die electrically connects the first device die to the second device die;
- an encapsulating material encapsulating the interconnect die therein;
- a through-via penetrating through the encapsulating material to connect to the first device die;
- and
- an integrated passive device bonded to one of the first device die or the second device die.
A package comprising:
- a first device die and a second device die;
- an interconnect die underlying and bonded to both of the first device die and the second device die, wherein the interconnect die is free from passive devices therein, and the interconnect die comprising:
- a semiconductor substrate;
- and
- an interconnect structure over the semiconductor substrate, wherein the interconnect structure comprises a plurality of dielectric layers and a plurality of metal lines and vias, and wherein the first device die is electrically connected to the second device die through the interconnect structure;
- and
- an encapsulating material encapsulating the interconnect die therein.
A package comprising:
- a dielectric layer;
- a redistribution line comprising a via portion extending into the dielectric layer;
- a first die-attach film over and contacting the redistribution line;
- an interconnect die over, and having a back surface contacting, the first die-attach film, wherein the interconnect die is free from active devices and passive devices therein;
- and
- a first device die and a second device die over and bonded to the interconnect die, wherein the first device die and the second device die are interconnected through the interconnect die.
Dependencies are inferred from the claim text.