H10W 90/794

Between a chip and a stacked insulating package substrate, interposer or rdl

Official title: {between a chip and a stacked insulating package substrate, interposer or RDL}

H10W90/794 (Between a chip and a stacked insulating package substrate, interposer or rdl) appears on 1,216 US grants and 2,366 published applications in this corpus.

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Granted patents
1,216
Published applications
2,366
Assignees
360
Inventors
3,254
Latest grant
6 Oct 2026

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H10W 90/794: granted patents and published applications per publication year
YearGranted patentsPublished applications
198710
198800
198900
199000
199100
199210
199300
199400
199500
199600
199700
199810
199900
200010
200100
200222
200314
200424
200525
200625
2007512
200839
200996
201056
201157
2012916
2013717
20141533
20153041
20163858
20174946
20184060
201955100
202089143
2021100150
2022107250
2023161217
2024160359
2025154447
2026162369

By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.

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