IC substrate with support structure and functional inlays therein
AssigneeAT&S Austria Technologie & Systemtechnik Aktiengesellschaft
InventorsGerald Weis, Stefano Sergio Oggioni, Markus Leitgeb, Marco Gavagnin
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Abstract
An integrated circuit substrate for surface mounting an integrated circuit component thereon, wherein the integrated circuit substrate comprises a support structure having at least one hole, and at least two functional inlays placed inside said at least one hole side by side, wherein a pitch at an integrated circuit component mounting side of the integrated circuit substrate is not more than 150 μm.
Claims19
An integrated circuit substrate for surface mounting an integrated circuit component thereon, wherein the integrated circuit substrate comprises:
- a support structure having at least one hole;
- and at least two functional inlays placed inside said at least one hole side by side;
- wherein a pitch at an integrated circuit component mounting side of the integrated circuit substrate is not more than 150 μm, and wherein the pitch at the integrated circuit component mounting side is different in regions of different functional inlays.
A method of manufacturing an integrated circuit substrate for surface mounting an integrated circuit component thereon, wherein the method comprises:
- providing a support structure with at least one hole;
- placing at least two functional inlays inside said at least one hole side by side;
- and forming a pitch at an integrated circuit component mounting side of the integrated circuit substrate being not more than 150 μm, wherein the pitch at the integrated circuit component mounting side is different in regions of different functional inlays.
Dependencies are inferred from the claim text.