Surface mount package having an internal redundant electrical connection

A surface mount system-in-package, comprising:

• a power semiconductor die attached to a metallic pad such that a first side of the power semiconductor die faces the metallic pad and a second side opposite the first side faces away from the metallic pad, the metallic pad forming a first power terminal exposed at a surface mounting side of the surface mount system-in-package;
• an additional semiconductor die attached to the same or different metallic pad as the power semiconductor die, the additional semiconductor die comprising a driver device configured to provide a drive input for a gate of a power transistor included in the power semiconductor die;
• a second power terminal, a first sense terminal, and a gate terminal each exposed at the surface mounting side and spaced apart from the first power terminal;
• a first electrical connection between the second power terminal and a first power pad at the second side of the power semiconductor die;
• a second electrical connection between the gate terminal and a driver input pad of the additional semiconductor die;
• a third electrical connection between the first sense terminal and a first sense pad at the second side of the power semiconductor die;
• a first redundant electrical connection for the second electrical connection or the third electrical connection;
• and
• a mold compound encasing each of the power semiconductor die, the additional semiconductor die, the first electrical connection, the second electrical connection, the third electrical connection, and the first redundant electrical connection.