Liquid cooling module
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsSung-Ju HUANG, Yung-Tsun LIU, Kuang-Wei CHENG
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Abstract
An apparatus is provided. The apparatus includes a first platform configured to support a plurality of items to be bonded together in a bonding process. The apparatus includes a second platform over the plurality of items. At least one of the first platform or the second platform is configured to apply a pressing force to the plurality of items during the bonding process. The apparatus includes a liquid cooling module configured to conduct, after the bonding process, a liquid through a cooling channel to cool at least one of the first platform or the second platform.
Claims21
An apparatus, comprising:
- a first platform configured to support a plurality of items to be bonded together in a first bonding process;
- a second platform over the plurality of items, wherein at least one of the first platform or the second platform is configured to apply a pressing force to the plurality of items during the first bonding process;
- and
- a liquid cooling module comprising a cooling channel housing disposed over an uppermost surface of the second platform and configured to conduct, after the first bonding process and prior to a second bonding process, a liquid through a cooling channel defined within the cooling channel housing to cool the second platform.
-12. (canceled)
An apparatus, comprising:
- a first platform configured to support a plurality of items to be bonded together in a bonding process;
- a second platform over the plurality of items, wherein at least one of the first platform or the second platform is configured to apply a pressing force to the plurality of items during the bonding process;
- and
- a liquid cooling module configured to conduct, after the bonding process, a liquid through a cooling channel disposed within the liquid cooling module to cool the second platform, wherein the second platform is disposed between the plurality of items and the liquid cooling module.
An apparatus, comprising:
- a first platform configured to apply a pressing force to a semiconductor wafer during a first bonding process to bond one or more items to the semiconductor wafer;
- and
- a liquid cooling module over the first platform and comprising a cooling channel having at least three concentric, arc-shaped sections between an inlet and an outlet, wherein a central angle of an innermost concentric, arc-shaped section of the at least three concentric, arc-shaped sections is more than 180 degrees.
Dependencies are inferred from the claim text.