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US 6,306,731 B1Granted
Semiconductor device and method for fabricating the same
AssigneeOki Electric Industry Co., Ltd.
InventorsTadashi Igarashi, Akinori Tsukuda
Life of this patent
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Abstract
In a method, first and second circuit elements are provided on a surface of a semiconductor substrate; and a hole is formed in the semiconductor substrate between the first and second circuit elements. Then, the semiconductor substrate is divided at the hole to separate the first and second circuit elements from each other.
Claims24
A method for fabricating a semiconductor device, comprising the steps of:
- providing a semiconductor substrate;
- providing first and second circuit elements on a surface of the semiconductor substrate;
- providing a hole in the semiconductor substrate between the first and second circuit elements;
- and
- dividing the semiconductor substrate at the hole to separate the first and second circuit elements from each other.
2 more elements
A method for fabricating a semiconductor device, comprising the steps of:
- providing a semiconductor substrate;
- providing first and second circuit elements on a surface of the semiconductor substrate;
- forming a hole on the surface of the semiconductor substrate between the first and second circuit elements, the hole not passing through the semiconductor substrate;
- providing a first conductive layer in the hole so that the first conductive layer is connected to the first and second circuit elements;
- removing an other surface of the semiconductor substrate until the first conductive layer is exposed, but whereby the hole does not pass through the semiconductor substrate;
- providing a second conductive layer on the removed surface of the semiconductor substrate so that the second conductive layer is connected to the first conductive layer;
- cutting the semiconductor substrate at the hole so that the first and second circuit elements are separated from each other;
- and
- connecting the second conductive layer to a lead frame so that each of the first and second circuit elements is electrically connected to the lead frame.
6 more elements
A method for fabricating a semiconductor device, comprising the steps of:
- providing a semiconductor substrate;
- providing first and second circuit elements on a surface of the semiconductor substrate;
- forming a hole on the surface of the semiconductor substrate between the first and second circuit elements, the hole not passing through the semiconductor substrate;
- providing a first conductive layer in the hole so that the first conductive layer is connected to the first and second circuit elements;
- removing an other surface of the semiconductor substrate until the first conductive layer is exposed and the hole passes completely through the semiconductor substrate to separate the first and second circuit elements from each other;
- providing a second conductive layer on the removed surface of the semiconductor substrate so that the second conductive layer is connected to the first conductive layer;
- and
- connecting the second conductive layer to a lead frame so that each of the first and second circuit elements is electrically connected to the lead frame.
5 more elements
A method for fabricating a semiconductor device, comprising the steps of:
- providing a semiconductor substrate;
- providing first and second circuit elements on a surface of the semiconductor substrate;
- providing a first conductive layer on the surface of the semiconductor substrate so that the first conductive layer is connected to the first and second circuit elements;
- forming a hole on an other surface of the semiconductor substrate on which no circuit element is provided, between the first and second circuit elements so that the first conductive layer is exposed to the hole;
- providing a second conductive layer in the hole so that the first conductive layer and the second conductive layer are connected to each other;
- cutting the semiconductor substrate at the hole to separate the first and second circuit elements from each other;
- and
- connecting the second conductive layer to a lead frame so that each of the first and second circuit elements is electrically connected to the lead frame.
5 more elements
A semiconductors device fabricated by a method comprising the steps of:
- providing a semiconductor substrate;
- providing first and second circuit elements on a surface of the semiconductor substrate;
- providing a hole in the semiconductor substrate between the first and second circuit elements;
- and
- dividing the semiconductor substrate at the hole to separate the first and second circuit elements from each other.
2 more elements
A method of fabricating a semiconductor device, comprising:
- forming first and second circuit elements on a surface of a semiconductor substrate;
- forming a hole in the semiconductor substrate;
- forming a conductive layer on the semiconductor substrate so as to extend from a top surface of the first circuit element and a top surface of the second circuit element to an interior surface of the hole;
- removing an other surface of the semiconductor substrate so as to expose the conductive layer from the other surface of the semiconductor substrate;
- and
- dividing the semiconductor substrate at the hole to separate the first circuit element and the second circuit element, whereby the exposed conductive layer is divided.
3 more elements
A method of fabricating a semiconductor device, comprising:
- forming first and second circuit elements on a surface of a semiconductor substrate;
- forming a hole in the semiconductor substrate, the hole having a side wall and bottom surface;
- forming a conductive layer on the semiconductor substrate so as to extend from a top surface of the first circuit element and a top surface of the second circuit element to the side wall of the hole;
- and
- dividing the semiconductor substrate along the bottom surface of the hole to separate the first circuit element and the second circuit element, whereby the conductive layer remains in the side wall of the hole.
2 more elements
A method of fabricating a semiconductor device, comprising:
- forming first and second circuit elements on a surface of a semiconductor substrate;
- forming a hole in the semiconductor substrate between the first and second circuit elements, wherein the hole extends from one end of the semiconductor substrate to an other end of the semiconductor substrate;
- forming a first conductive layer on the semiconductor substrate so as to extend from a top surface of the first circuit element and a top surface of the second circuit element to an interior surface of the hole;
- and
- removing an other surface of the semiconductor substrate so as to expose the first conductive layer from the other surface of the semiconductor substrate.
2 more elements
Dependencies are inferred from the claim text.