Chip package structure
AssigneeTong Hsing Electronic Industries, Ltd.
InventorsYan-Wei Chen, Chih-Jen Su
Life of this patent
Estimating the term…
Abstract
A chip package structure includes a circuit substrate, a lead frame, a first chip, a second chip, a connecting member, and a package body. The lead frame is stacked on the circuit substrate, and the lead frame is bent to form an accommodating space. The first chip is disposed on the lead frame and located in the accommodating space. The second chip is disposed on the circuit substrate and located in the accommodating space. The connecting member is used to connect the lead frame and the circuit substrate. The package body is disposed on the circuit substrate and covers the first chip, the second chip, and the lead frame.
Claims13
A chip package structure, comprising:
- a circuit substrate;
- a lead frame stacked on the circuit substrate, wherein the lead frame is bent to form an accommodating space;
- a first chip disposed on the lead frame, wherein the first chip is located in the accommodating space;
- a second chip disposed on the circuit substrate, wherein the second chip is located in the accommodating space;
- a connecting member connected to the lead frame and the circuit substrate;
- and
- a package body disposed on the circuit substrate, wherein the package body is an integral one-piece structure that embeds the second chip and the lead frame, and an upper surface of the lead frame is partially lower than an upper surface of the package body.
Dependencies are inferred from the claim text.