Package structure and method of manufacturing the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsMing-Fa Chen, Sung-Feng Yeh, Tzuan-Horng Liu, Chao-Wen Shih
Life of this patent
Estimating the term…
Abstract
A package structure includes a first die, a die stack structure, a support structure and an insulation structure. The die stack structure is bonded to the first die. The support structure is disposed on the die stack structure. A width of the support structure is larger than a width of the die stack structure and less than a width of the first die. The insulation structure at least laterally wraps around the die stack structure and the support structure.
Claims20
A package structure, comprising:
- a first die;
- a die stack structure bonded to the first die;
- a support structure, disposed on the die stack structure, wherein a width of the support structure is larger than a width of the die stack structure and less than a width of the first die;
- and
- an insulation structure, at least laterally wrapping around the die stack structure and the support structure.
A package structure, comprising:
- a first die;
- at least one second die bonded to the first die, wherein the first die laterally extends beyond a sidewall of the at least one second die;
- and
- a dummy die structure, bonded to the at least one second die,
- wherein a sidewall of the first die, the sidewall of the at least one second die and a sidewall of the dummy die structure are laterally offset from each other.
A method of forming a package structure, comprising:
- providing a first die;
- bonding a die stack structure to the first die, wherein the die stack structure comprises at least one second die;
- bonding a support structure to the die stack structure by a fusion bonding process, wherein a width of the support structure is larger than a width of the die stack structure and less than a width of the first die;
- and
- forming an insulation structure to laterally wrap around the support structure and the die stack structure, wherein at least a portion of the insulation structure is formed after bonding the support structure to the die stack structure.
Dependencies are inferred from the claim text.