Liquid cooling to cpu/mcm bond and package process flow

A method for manufacturing a cooling apparatus, the method comprising:

• forming an integrated cooling assembly by directly bonding a first portion of a cold plate to a backside of a first die, wherein a second portion of the cold plate is spaced apart from the backside of the first die to define a channel volume having an inlet portion and an outlet portion that are open at a cold plate backside of the cold plate;
• closing the inlet portion and the outlet portion by attaching a side of a substrate to the cold plate backside, the substrate comprising respective planarized material portions disposed at the side of the substrate and over each of the inlet portion and the outlet portion;
• attaching the integrated cooling assembly to an interposer;
• and
• subsequent to attaching the integrated cooling assembly to the interposer, opening the inlet portion and the outlet portion by removing the respective planarized material portions.