H10W 72/652
Comprising metals or metalloids
Official title: {comprising metals or metalloids, e.g. silver}
H10W72/652 (Comprising metals or metalloids) appears on 1,255 US grants and 1,507 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,255
- Published applications
- 1,507
- Assignees
- 276
- Inventors
- 2,019
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 3 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 2 | 0 |
| 1995 | 3 | 0 |
| 1996 | 4 | 0 |
| 1997 | 2 | 0 |
| 1998 | 3 | 0 |
| 1999 | 2 | 0 |
| 2000 | 6 | 0 |
| 2001 | 7 | 3 |
| 2002 | 9 | 18 |
| 2003 | 17 | 17 |
| 2004 | 14 | 22 |
| 2005 | 14 | 22 |
| 2006 | 16 | 39 |
| 2007 | 18 | 53 |
| 2008 | 20 | 50 |
| 2009 | 30 | 62 |
| 2010 | 47 | 50 |
| 2011 | 50 | 63 |
| 2012 | 57 | 85 |
| 2013 | 76 | 81 |
| 2014 | 72 | 100 |
| 2015 | 96 | 114 |
| 2016 | 101 | 93 |
| 2017 | 89 | 85 |
| 2018 | 64 | 62 |
| 2019 | 65 | 59 |
| 2020 | 50 | 64 |
| 2021 | 70 | 94 |
| 2022 | 55 | 80 |
| 2023 | 57 | 63 |
| 2024 | 54 | 60 |
| 2025 | 46 | 39 |
| 2026 | 21 | 29 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Power semiconductor module29 Sep 2026US 12,751,317 B2Wuxi Leapers Semiconductor Co., Ltd.
- Electrical circuit body, power converter, and electrical circuit body manufacturing method4 Aug 2026US 12,702,049 B2Hitachi Astemo, Ltd.
- Semiconductor device4 Aug 2026US 12,702,054 B2Fuji Electric Co., Ltd.
- Semiconductor device for upper and lower arm circuits21 Jul 2026US 12,690,471 B2Denso Corporation
- Package structure for power semiconductor devices with improved parasitic parameters21 Jul 2026US 12,690,495 B2Nexperia B. V.
- Clips for semiconductor package and related methods24 Sep 2026US 2026/0293708 A1Semiconductor Components Industries, LLC
- Monolithic spring assemblies for high-frequency press-pack modules20 Aug 2026US 2026/0248017 A1
- Semiconductor package having dual transistors and method of making the same6 Aug 2026US 2026/0231820 A1Alpha and Omega Semiconductor International LP
- Al connection material16 Jul 2026US 2026/0200018 A1Nippon Micrometal Corporation
- Al connection material16 Jul 2026US 2026/0201510 A1Nippon Micrometal Corporation
Most cited
By later US patents
- Leadless semiconductor device and method for making the same346US 5,172,214 AMotorola, Inc. · 1992
- Semiconductor device including cladded base plate274US 8,963,321 B2Infineon Technologies AG · 2015
- Self-centering electrode for power devices249US 4,935,803 AMotorola, Inc. · 1990
- Semiconductor package243US 6,040,626 AInternational Rectifier Corporation · 2000
- Method for coupling a power lead to a bond pad in an electronic module235US 5,544,412 AMotorola, Inc. · 1996