H10W 72/6528
Intermetallic compounds
Official title: {Intermetallic compounds}
H10W72/6528 (Intermetallic compounds) appears on 12 US grants and 19 published applications in this corpus.
Search patents in H10W- Granted patents
- 12
- Published applications
- 19
- Assignees
- 6
- Inventors
- 24
- Latest grant
- 18 Mar 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2016 | 0 | 1 |
| 2017 | 1 | 2 |
| 2018 | 0 | 0 |
| 2019 | 2 | 3 |
| 2020 | 1 | 1 |
| 2021 | 3 | 2 |
| 2022 | 0 | 3 |
| 2023 | 1 | 2 |
| 2024 | 2 | 1 |
| 2025 | 2 | 3 |
| 2026 | 0 | 1 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Semiconductor packages with an intermetallic layer18 Mar 2025US 12,255,167 B2Semiconductor Components Industries, LLC
- Semiconductor devices and methods of manufacturing semiconductor devices11 Feb 2025US 12,224,230 B2Amkor Technology Singapore Holding Pte.Ltd.
- Pre-plating of solder layer on solderable elements for diffusion soldering20 Aug 2024US 12,069,802 B2Infineon Technologies AG
- Semiconductor device and method for fabricating the same2 Jul 2024US 12,027,490 B2Infineon Technologies AG
- Semiconductor device including a solder compound containing a compound Sn/Sb3 Oct 2023US 11,776,927 B2Infineon Technologies AG
- Semiconductor devices and methods of manufacturing semiconductor devices14 May 2026US 2026/0136952 A1Amkor Technology Singapore Holding Pte.Ltd.
- Semiconductor packages with an intermetallic layer19 Jun 2025US 2025/0201753 A1Semiconductor Components Industries, LLC
- Semiconductor packages with an intermetallic layer5 Jun 2025US 2025/0183217 A1Semiconductor Components Industries, LLC
- Clip27 Mar 2025US 2025/0105198 A1Nexperia B. V.
- Pre-Plating of Solder Layer on Solderable Elements for Diffusion Soldering7 Nov 2024US 2024/0373548 A1Infineon Technologies AG
Most cited
By later US patents
- Methods of forming semiconductor packages with an intermetallic layer comprising tin and at least one of silver, copper or nickel10US 9,564,409 B2Semiconductor Components Industries, LLC · 2017
- Semiconductor packages with an intermetallic layer1US 11,049,833 B2Semiconductor Components Industries, LLC · 2021