H10W 20/4407
Aluminium alloys
Official title: {Aluminium alloys}
H10W20/4407 (Aluminium alloys) appears on 293 US grants and 235 published applications in this corpus.
Search patents in H10W- Granted patents
- 293
- Published applications
- 235
- Assignees
- 107
- Inventors
- 558
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 3 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 6 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 3 | 0 |
| 1991 | 6 | 0 |
| 1992 | 2 | 0 |
| 1993 | 4 | 0 |
| 1994 | 5 | 0 |
| 1995 | 3 | 0 |
| 1996 | 10 | 0 |
| 1997 | 1 | 0 |
| 1998 | 7 | 0 |
| 1999 | 12 | 0 |
| 2000 | 10 | 0 |
| 2001 | 15 | 3 |
| 2002 | 8 | 11 |
| 2003 | 8 | 4 |
| 2004 | 11 | 8 |
| 2005 | 5 | 5 |
| 2006 | 3 | 0 |
| 2007 | 5 | 6 |
| 2008 | 2 | 2 |
| 2009 | 0 | 7 |
| 2010 | 4 | 5 |
| 2011 | 5 | 6 |
| 2012 | 2 | 3 |
| 2013 | 6 | 3 |
| 2014 | 11 | 17 |
| 2015 | 5 | 10 |
| 2016 | 15 | 22 |
| 2017 | 25 | 11 |
| 2018 | 17 | 16 |
| 2019 | 11 | 16 |
| 2020 | 12 | 11 |
| 2021 | 8 | 8 |
| 2022 | 7 | 12 |
| 2023 | 8 | 14 |
| 2024 | 9 | 13 |
| 2025 | 4 | 13 |
| 2026 | 9 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor structure and manufacturing method thereof29 Sep 2026US 12,751,258 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device and method of manufacturing the same25 Aug 2026US 12,721,141 B2Renesas Electronics Corporation
- Interconnect structure16 Jun 2026US 12,660,593 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Metal film and manufacturing method of the metal film, and semiconductor device and method of manufacturing the semiconductor device12 May 2026US 12,628,408 B2Renesas Electronics Corporation
- Interconnect structures with nitrogen-rich dielectric material interfaces for low resistance vias in integrated circuits21 Apr 2026US 12,610,806 B2Intel Corporation
- Contact window, memory unit, and memory device and fabrication method thereof24 Sep 2026US 2026/0293650 A1Semiconductor Manufacturing Beijing Corporation
- Metal film and manufacturing method of the metal film, and semiconductor device and method of manufacturing the semiconductor device20 Aug 2026US 2026/0247685 A1Renesas Electronics Corporation
- Semiconductor device18 Jun 2026US 2026/0173523 A1Rohm Co., Ltd.
- Semiconductor devices4 Jun 2026US 2026/0157168 A1Samsung Electronics Co., Ltd.
- Metal interconnect structures and methods thereof7 May 2026US 2026/0130206 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Semiconductor device having an improved metal interconnect structure82US 5,442,235 AMotorola, Inc. · 1995
- High aspect ratio low resistivity lines/vias by surface diffusion65US 5,897,370 AInternational Business Machines Corporation · 1999
- Process for fabricating a semiconductor device having an improved metal interconnect structure61US 5,527,739 AMotorola, Inc. · 1996
- Semiconductor device including interlayer dielectric film layers and conductive film layers57US 5,459,353 AMatsushita Electronics Corporation · 1995
- Methods and solutions for cleaning polished aluminum-containing layers, methods for making metallization structures, and the structures resulting from these methods57US 6,265,781 B1Micron Technology, Inc. · 2001